Gábor Harsányi – författare

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects and thermal management capability have been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity, highlighting recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed for finer resolution thick film inks and high performance-low temperature dielectric tapes. Precision via generation by both laser and mechanical methods and enhanced screen printing technologies have provided feature resolution to the 50 mmm line/space level. MCM-C technology is compatible with thick film sensors and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Polymer films now play an essential and growing role in sensors. Recent advances in polymer science and film preparation have made polymer films useful, practical and economical in a wide range of sensor designs and applications. Further, the continuing miniaturization of microelectronics favors the use of polymer thin films in sensors.This new book is the first comprehensive presentation of this technology. It covers both scientific fundamentals and practical engineering aspects. Included is an extensive survey of all types of sensors and applications. The very detailed table of contents in the next pages provides full information on content. More than 200 schematics illustrate a wide variety of sensor structures and their function.

Polymer films now play an essential and growing role in sensors. Recent advances in polymer science and film preparation have made polymer films useful, practical and economical in a wide range of sensor designs and applications. Further, the continuing miniaturization of microelectronics favors the use of polymer thin films in sensors.This new book is the first comprehensive presentation of this technology. It covers both scientific fundamentals and practical engineering aspects. Included is an extensive survey of all types of sensors and applications. The very detailed table of contents in the next pages provides full information on content. More than 200 schematics illustrate a wide variety of sensor structures and their function.

Sensors in Biomedical Applications presents information on sensor types in a comprehensive and easy to understand format. The first four chapters concentrate on the basics, lending an understanding to operation and design principles of sensor elements. They introduce basic terms, sensor technologies, sensor structure and sensing effects. The next three chapters describe application possibilities, such as physical sensors, sensors for measuring chemical qualities and biosensors. The final chapters address biocompatability, discuss future trends, and furnish a convenient glossary of acronyms.

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.