WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING – serie

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9 produkter

Del 7 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
THERMOELECTRIC ENERGY CONVERSION DEVICES AND SYSTEMS
AvKazuaki Yazawa,Je-Hyeong Bahkm. fl.
Inbunden, Engelska, 2021
1 776 kr
Skickas inom 3-6 vardagar
This unique compendium emphasizes key factors driving the performance of thermoelectric energy conversion systems. Important design parameters such as heat transfer at the boundaries of the system, material properties, and form factors are carefully analyzed and optimized for performance including the cost-performance trade-off. Numbers of examples are provided on the applications of thermoelectric technologies, e.g., power generation, cooling of electronic components, and waste heat recovery in wearable devices.This must-have volume also includes an interactive modeling software package developed on the nanoHUB (https://nanohub.org/) platform. Professionals, researchers, academics, undergraduate and graduate students will be able to study the impact of material properties and key design parameters on the overall thermoelectric system performance as well as the large scale implementation in the society.
Del 8 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
EMBEDDED COOLING OF ELECTRONIC DEVICES: CONDUCTION, EVAPORATION, AND SINGLE- AND TWO-PHASE CONVECTION
AvIyengar Madhusudan,Madhusudan Iyengarm. fl.
Inbunden, Engelska, 2024
2 041 kr
Skickas inom 3-6 vardagar
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Del 4 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
COST ANALYSIS OF ELECTRONIC SYSTEMS (SECOND EDITION)
AvPeter Sandborn
Inbunden, Engelska, 2017
2 823 kr
Skickas inom 3-6 vardagar
This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.
Del 5 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
MEMS PACKAGING
AvLee Y C,Y C Leem. fl.
Inbunden, Engelska, 2018
2 038 kr
Skickas inom 3-6 vardagar
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Del 6 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
SOLDER MATERIALS
AvKwang-Lung Lin
Inbunden, Engelska, 2018
2 041 kr
Skickas inom 3-6 vardagar
This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
Del 1 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
COST ANALYSIS OF ELECTRONIC SYSTEMS
AvPeter Sandborn
Inbunden, Engelska, 2012
2 170 kr
Skickas inom 3-6 vardagar
Understanding the cost ramifications of design, manufacturing and life-cycle management decisions is of central importance to businesses associated with all types of electronic systems. Cost Analysis of Electronic Systems contains carefully developed models and theory that practicing engineers can directly apply to the modeling of costs for real products and systems. In addition, this book brings to light and models many contributions to life-cycle costs that practitioners are aware of but never had the tools or techniques to address quantitatively in the past.Cost Analysis of Electronic Systems melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity-based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems and return on investment are addressed.Real life design scenarios from integrated circuit fabrication, electronic systems assembly, substrate fabrication, and electronic systems managementare used as examples of the application of the cost estimation methods developed within the book.
Del 2 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS
AvMadhavan Swaminathan,Ki Jin Han
Inbunden, Engelska, 2013
1 892 kr
Skickas inom 3-6 vardagar
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Del 3 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH
AvIyengar Madhusudan,Madhusudan Iyengarm. fl.
Inbunden, Engelska, 2014
2 329 kr
Skickas inom 3-6 vardagar
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Del 9 - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
DIAMOND INTEGRATION FOR ELECTRONICS COOLING
AvGraham Samuel,Samuel Grahamm. fl.
Inbunden, Engelska, 2026
905 kr
Kommande
This book provides a practical, research-led guide to integrating Chemical Vapor Deposition (CVD) diamond films for next-generation electronics cooling. Drawing on contributions from academia, national laboratories, and industry, Diamond Integration for Electronics Cooling highlights real-world implementations in high-power, high-frequency systems. The thermal management of high-power density electronics—particularly devices made from wide bandgap semiconductors—has recently advanced through the integration of heat spreading materials at the die level. Among the approaches being pursued, the use polycrystalline and single crystalline diamond films have shown the most promise due to the high thermal conductivity of diamond and the scalable integration through direct growth onto the die. This book explores the critical aspects of developing diamond films and methods of integration to improve the thermal management of high power density devices. It guides the reader through the fundamentals of the thermal conductivity of CVD diamond films, steady state and transient characterization of their thermal conductivity, and addresses the thermal properties of polycrystalline diamonds. The book then covers methods for growth of nanocrystalline CVD diamond films using microwave plasma CVD. This includes the methodology for the transfer of carbon from methane into the diamond lattice, diamond seeding to promote growth, and the growth mechanisms that impact grain structure and size. Finally, the integration and impact on electronic devices is covered. Building on this, the book covers the direct growth of diamond onto the backside of GaN RF devices at the wafer scale and its impact on device performance, and the development of metal-diamond composites for the packaging of high power density electronics.

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WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING – serie

THERMOELECTRIC ENERGY CONVERSION DEVICES AND SYSTEMS

EMBEDDED COOLING OF ELECTRONIC DEVICES: CONDUCTION, EVAPORATION, AND SINGLE- AND TWO-PHASE CONVECTION

COST ANALYSIS OF ELECTRONIC SYSTEMS (SECOND EDITION)

MEMS PACKAGING

SOLDER MATERIALS

COST ANALYSIS OF ELECTRONIC SYSTEMS

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS

COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH

DIAMOND INTEGRATION FOR ELECTRONICS COOLING

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