From the reviews: "Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

• Some Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.

From the reviews: "Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

• Some Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.

From the reviews: "Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

• Some Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.