Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

AvShichun Qu,Yong Liu

Inbunden, Engelska, 2014

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Beskrivning

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

Produktinformation

Utgivningsdatum:2014-09-11
Mått:155 x 235 x 24 mm
Vikt:676 g
Format:Inbunden
Språk:Engelska
Antal sidor:322
Upplaga:2015
Förlag:Springer-Verlag New York Inc.
ISBN:9781493915552

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Recensioner i media

"Wafer Level Chip-Scale Packaging by Qu, Shichun, Liu, Yong presents good technical insights of wafer-level chip scale packaging (WLCSP) technology, suitable for both industry and academic practitioners. ... It is a good reference to demonstrate the alternate wafer-level chip scale packaging, and can serve as a very informative technical reference. ... The book is valuable as a learning tool for WLCSP and its clear relevance to real-world industry practices make it useful for both students and reliability practitioners." (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, August, 2015)

Innehållsförteckning

Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging.- Chapter 2. Fan-In Analog Wafer Level Chip Scale Package.- Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package.- Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design.- Chapter 5. Wafer Level Discrete Power MOSFET Package Design.- Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution.- Chapter 7. Thermal Management, Design, Analysis for WLCSP.- Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP.- Chapter 9. WLCSP Typical Assembly Process.- Chapter 10. WLCSP Typical Reliability and Test.