Yong Liu – författare

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61 produkter

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61 produkter

Melt Electrospinning
A Green Method to Produce Superfine Fibers
AvYong Liu,Seeram Ramakrishnam. fl.
Häftad, Engelska, 2019
1 740 kr
Skickas inom 10-15 vardagar
Melt Electrospinning: A Green Method to Produce Superfine Fibers introduces the latest results from a leading research group in this area, exploring the structure, equipment polymer properties and spinning conditions of melt electrospinning. Sections introduce the invention of melt electrospinning, including the independent development of centrifugal melt electrospinning and upward melt electrospinning, discuss electro magnetization of melt and the testing method of fiber performance by means of different polymers and self-designed devices, cover simulation, and introduce principle methods and improvement measures of centrifugal melt electrospinning.
Presents melt electrospinning, a green nanofiber fabrication technology Introduces the invention of melt electrospinning, including centrifugal melt electrospinning and upward melt electrospinning Describes optimization techniques, electro magnetization of melt, testing methods, DPD simulation and improvement methods Provides a useful introduction to contemporary electrospinning research with a view to its many potential applications
Melt Electrospinning
A Green Method to Produce Superfine Fibers
AvKaili Li,Mohamedazeem M. Mohideenm. fl.
E-bok
Engelska, 2019
2 549 kr
Läs direkt efter köp
Melt Electrospinning: A Green Method to Produce Superfine Fibers introduces the latest results from a leading research group in this area, exploring the structure, equipment polymer properties and spinning conditions of melt electrospinning. Sections introduce the invention of melt electrospinning, including the independent development of centrifugal melt electrospinning and upward melt electrospinning, discuss electro magnetization of melt and the testing method of fiber performance by means of different polymers and self-designed devices, cover simulation, and introduce principle methods and improvement measures of centrifugal melt electrospinning.- Presents melt electrospinning, a green nanofiber fabrication technology- Introduces the invention of melt electrospinning, including centrifugal melt electrospinning and upward melt electrospinning- Describes optimization techniques, electro magnetization of melt, testing methods, DPD simulation and improvement methods- Provides a useful introduction to contemporary electrospinning research with a view to its many potential applications
Quality of Service in Optical Burst Switched Networks
AvKee Chaing Chua,Mohan Gurusamym. fl.
Inbunden, Engelska, 2006
1 113 kr
Skickas inom 10-15 vardagar
Quality of Service in Optical Burst Switched Networks is a broad review and reference for researchers and professionals of Quality of Service (QoS) support in Optical Burst Switching (OBS) networks. The authors start with an overview of OBS architecture, then categorize and discuss existing QoS support in OBS including relative and absolute models, mechanisms for supporting multiple traffic classes, edge-to-edge provisioning, and other non-mainstream mechanisms.Optical networking professionals will find the literature review as an up-to-date coverage of topics which is both timely and helpful.
Quality of Service in Optical Burst Switched Networks
AvMinh Hoang Phung,Yong Lium. fl.
E-bok
PDF, Engelska, 2007
1 416 kr
Läs direkt efter köp
Quality of Service in Optical Burst Switched Networks is a broad review and reference for researchers and professionals of Quality of Service (QoS) support in Optical Burst Switching (OBS) networks. The authors start with an overview of OBS architecture, then categorize and discuss existing QoS support in OBS including relative and absolute models, mechanisms for supporting multiple traffic classes, edge-to-edge provisioning, and other non-mainstream mechanisms.
Optical networking professionals will find the literature review as an up-to-date coverage of topics which is both timely and helpful.
New Polymeric Products
Fundamentals, Forming Methods and Applications
AvYong Liu,Jing Gem. fl.
Häftad, Engelska, 2023
2 581 kr
Skickas inom 10-15 vardagar
New Polymeric Products: Fundamentals, Forming Methods and Applications introduces applications of polymer materials in different fields, including new products and processing methods. This book is rich in content and creativity and introduces the development, history, characteristics and existing processing methods of polymer materials in a comprehensive and systematic manner. Sections include the latest achievements from future travel, energy problems, special environment, lens materials and biomedicine, which are the most concerning areas of human society today. The book also introduces forming principles, methods, achievements and development prospects from shallow to profound. It will benefit researchers and new academic participants and broaden their vision.

Sections cover the development history and prospect of polymer materials, introduce polymer materials, including new materials, characteristics, synthesis, naming and functionality, and delve into new processing and forming methods which are introduced in three parts: plastic, rubber and fiber according to different product types.
Composed of relevant research results from the author's team, including general basic knowledge and the latest research in relevant fieldsIntroduces basic knowledge such as polymer development history, material characteristics and forming principlesArranges trivial contents such as polymer development history in tables to make it clearer and easier to understandGives readers a clearer understanding of products, processing equipment and processes
New Polymeric Products
Fundamentals, Forming Methods and Applications
AvPing Hu,Ce Wangm. fl.
E-bok
Engelska, 2023
3 677 kr
Läs direkt efter köp
New Polymeric Products: Fundamentals, Forming Methods and Applications introduces applications of polymer materials in different fields, including new products and processing methods. This book is rich in content and creativity and introduces the development, history, characteristics and existing processing methods of polymer materials in a comprehensive and systematic manner. Sections include the latest achievements from future travel, energy problems, special environment, lens materials and biomedicine, which are the most concerning areas of human society today. The book also introduces forming principles, methods, achievements and development prospects from shallow to profound. It will benefit researchers and new academic participants and broaden their vision.Sections cover the development history and prospect of polymer materials, introduce polymer materials, including new materials, characteristics, synthesis, naming and functionality, and delve into new processing and forming methods which are introduced in three parts: plastic, rubber and fiber according to different product types.- Composed of relevant research results from the author''s team, including general basic knowledge and the latest research in relevant fields- Introduces basic knowledge such as polymer development history, material characteristics and forming principles- Arranges trivial contents such as polymer development history in tables to make it clearer and easier to understand- Gives readers a clearer understanding of products, processing equipment and processes
Modeling and Simulation for Microelectronic Packaging Assembly
Manufacturing, Reliability and Testing
AvShen Liu,Yong Liu
Inbunden, Engelska, 2011
1 549 kr
Skickas inom 5-8 vardagar
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion websiteLiu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Modeling and Simulation for Microelectronic Packaging Assembly
Manufacturing, Reliability and Testing
AvYong Liu,Shen Liu
E-bok
PDF, Engelska, 2011
1 690 kr
Läs direkt efter köp
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book''s companion website
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Modeling and Simulation for Microelectronic Packaging Assembly
Manufacturing, Reliability and Testing
AvYong Liu,Shen Liu
E-bok
Engelska, 2011
1 690 kr
Läs direkt efter köp
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book''s companion website
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Machine Learning in Capacitive Deionization
AvHaohong Wang,Likun Panm. fl.
Inbunden, Engelska, 2027
1 918 kr
Kommande
Quality of Service in Optical Burst Switched Networks
AvKee Chaing Chua,Mohan Gurusamym. fl.
Häftad, Engelska, 2010
1 113 kr
Skickas inom 10-15 vardagar
Quality of Service in Optical Burst Switched Networks is a broad review and reference for researchers and professionals of Quality of Service (QoS) support in Optical Burst Switching (OBS) networks. The authors start with an overview of OBS architecture, then categorize and discuss existing QoS support in OBS including relative and absolute models, mechanisms for supporting multiple traffic classes, edge-to-edge provisioning, and other non-mainstream mechanisms.Optical networking professionals will find the literature review as an up-to-date coverage of topics which is both timely and helpful.
Power Electronic Packaging
Design, Assembly Process, Reliability and Modeling
AvYong Liu
Inbunden, Engelska, 2012
2 773 kr
Skickas inom 10-15 vardagar
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Power Electronic Packaging
Design, Assembly Process, Reliability and Modeling
AvYong Liu
E-bok
PDF, Engelska, 2012
3 500 kr
Läs direkt efter köp
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task''s unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book''s areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Power Electronic Packaging
Design, Assembly Process, Reliability and Modeling
AvYong Liu
Häftad, Engelska, 2014
2 773 kr
Skickas inom 10-15 vardagar
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications
AvShichun Qu,Yong Liu
Inbunden, Engelska, 2014
1 777 kr
Skickas inom 10-15 vardagar
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications
AvYong Liu,Shichun Qu
E-bok
PDF, Engelska, 2014
2 217 kr
Läs direkt efter köp
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications
AvShichun Qu,Yong Liu
Häftad, Engelska, 2016
1 777 kr
Skickas inom 10-15 vardagar
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Snow Without Trace: Postwar Experience of a Korean War Volunteer Soldier
AvYong Liu
Häftad, Kinesiska
481 kr
Skickas inom 3-6 vardagar
Practical Deep Learning at Scale with MLflow
Bridge the gap between offline experimentation and online production
AvYong Liu
Häftad, Engelska, 2022
623 kr
Skickas inom 5-8 vardagar
Train, test, run, track, store, tune, deploy, and explain provenance-aware deep learning models and pipelines at scale with reproducibility using MLflowKey FeaturesFocus on deep learning models and MLflow to develop practical business AI solutions at scaleShip deep learning pipelines from experimentation to production with provenance trackingLearn to train, run, tune and deploy deep learning pipelines with explainability and reproducibilityBook DescriptionThe book starts with an overview of the deep learning (DL) life cycle and the emerging Machine Learning Ops (MLOps) field, providing a clear picture of the four pillars of deep learning: data, model, code, and explainability and the role of MLflow in these areas.From there onward, it guides you step by step in understanding the concept of MLflow experiments and usage patterns, using MLflow as a unified framework to track DL data, code and pipelines, models, parameters, and metrics at scale. You’ll also tackle running DL pipelines in a distributed execution environment with reproducibility and provenance tracking, and tuning DL models through hyperparameter optimization (HPO) with Ray Tune, Optuna, and HyperBand. As you progress, you’ll learn how to build a multi-step DL inference pipeline with preprocessing and postprocessing steps, deploy a DL inference pipeline for production using Ray Serve and AWS SageMaker, and finally create a DL explanation as a service (EaaS) using the popular Shapley Additive Explanations (SHAP) toolbox.By the end of this book, you’ll have built the foundation and gained the hands-on experience you need to develop a DL pipeline solution from initial offline experimentation to final deployment and production, all within a reproducible and open source framework.What you will learnUnderstand MLOps and deep learning life cycle developmentTrack deep learning models, code, data, parameters, and metricsBuild, deploy, and run deep learning model pipelines anywhereRun hyperparameter optimization at scale to tune deep learning modelsBuild production-grade multi-step deep learning inference pipelinesImplement scalable deep learning explainability as a serviceDeploy deep learning batch and streaming inference servicesShip practical NLP solutions from experimentation to productionWho this book is forThis book is for machine learning practitioners including data scientists, data engineers, ML engineers, and scientists who want to build scalable full life cycle deep learning pipelines with reproducibility and provenance tracking using MLflow. A basic understanding of data science and machine learning is necessary to grasp the concepts presented in this book.
Stochastic Network Calculus
AvYuming Jiang,Yong Liu
Inbunden, Engelska, 2008
577 kr
Skickas inom 10-15 vardagar
Network calculus is a theory dealing with queuing systems found in computer networks. Its focus is on performance guarantees. Central to the theory is the use of alternate algebras such as the min-plus algebra to transform complex network systems into analytically tractable systems. To simplify the ana- sis, another idea is to characterize tra?c and service processes using various bounds. Since its introduction in the early 1990s, network calculus has dev- oped along two tracks—deterministic and stochastic. This book is devoted to summarizing results for stochastic network calculus that can be employed in the design of computer networks to provide stochastic service guarantees. Overview and Goal Like conventional queuing theory, stochastic network calculus is based on properly de?ned tra?c models and service models. However, while in c- ventional queuing theory an arrival process is typically characterized by the inter-arrival times of customers and a service process by the service times of customers, the arrival process and the service process are modeled in n- work calculus respectively by some arrival curve that (maybe probabilis- cally) upper-bounds the cumulative arrival and by some service curve that (maybe probabilistically) lower-bounds the cumulative service. The idea of usingboundstocharacterizetra?candservicewasinitiallyintroducedfor- terministic network calculus. It has also been extended to stochastic network calculus by exploiting the stochastic nature of arrival and service processes.
Stochastic Network Calculus
AvYong Liu,Yuming Jiang
E-bok
PDF, Engelska, 2009
739 kr
Läs direkt efter köp
Network calculus is a theory dealing with queuing systems found in computer networks. Its focus is on performance guarantees. Central to the theory is the use of alternate algebras such as the min-plus algebra to transform complex network systems into analytically tractable systems. To simplify the ana- sis, another idea is to characterize tra?c and service processes using various bounds. Since its introduction in the early 1990s, network calculus has dev- oped along two tracks—deterministic and stochastic. This book is devoted to summarizing results for stochastic network calculus that can be employed in the design of computer networks to provide stochastic service guarantees. Overview and Goal Like conventional queuing theory, stochastic network calculus is based on properly de?ned tra?c models and service models. However, while in c- ventional queuing theory an arrival process is typically characterized by the inter-arrival times of customers and a service process by the service times of customers, the arrival process and the service process are modeled in n- work calculus respectively by some arrival curve that (maybe probabilis- cally) upper-bounds the cumulative arrival and by some service curve that (maybe probabilistically) lower-bounds the cumulative service. The idea of usingboundstocharacterizetra?candservicewasinitiallyintroducedfor- terministic network calculus. It has also been extended to stochastic network calculus by exploiting the stochastic nature of arrival and service processes.
Stochastic Network Calculus
AvYuming Jiang,Yong Liu
Häftad, Engelska, 2010
577 kr
Skickas inom 10-15 vardagar
Network calculus is a theory dealing with queuing systems found in computer networks. Its focus is on performance guarantees. Central to the theory is the use of alternate algebras such as the min-plus algebra to transform complex network systems into analytically tractable systems. To simplify the ana- sis, another idea is to characterize tra?c and service processes using various bounds. Since its introduction in the early 1990s, network calculus has dev- oped along two tracks—deterministic and stochastic. This book is devoted to summarizing results for stochastic network calculus that can be employed in the design of computer networks to provide stochastic service guarantees. Overview and Goal Like conventional queuing theory, stochastic network calculus is based on properly de?ned tra?c models and service models. However, while in c- ventional queuing theory an arrival process is typically characterized by the inter-arrival times of customers and a service process by the service times of customers, the arrival process and the service process are modeled in n- work calculus respectively by some arrival curve that (maybe probabilis- cally) upper-bounds the cumulative arrival and by some service curve that (maybe probabilistically) lower-bounds the cumulative service. The idea of usingboundstocharacterizetra?candservicewasinitiallyintroducedfor- terministic network calculus. It has also been extended to stochastic network calculus by exploiting the stochastic nature of arrival and service processes.
3D Cinematic Aesthetics and Storytelling
AvYong Liu
Häftad, Engelska, 2019
577 kr
Skickas inom 10-15 vardagar
This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes. Since Avatar (2009), we have seen a 3D revival marked by its integration with new digital technologies. With this book, the author goes beyond exploring 3D’s spectacular graphics and considers how 3D can be used to enhance visual storytelling. The chapters include visual comparisons between 2D and 3D to highlight their respective narrative features; an examination of the narrative tropes and techniques used by contemporary 3D filmmakers; and a discussion of the narrative implications brought by the coexistence of flatness and depth in 3D visuality. In demonstrating 3D cinematic aesthetics and storytelling, Yong Liu analyses popular films such as Hugo (2011), Life of Pi (2012), Gravity (2013), Star Trek Into Darkness (2013, and The Great Gatsby (2013). The book is an investigation into contemporary forms of stereoscopic storytelling derived from a unique, long-existing mode of cinematic illusions.
Del 1074 - Advances in Intelligent Systems and Computing
Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery
Volume 1
AvYong Liu,Lipo Wangm. fl.
Häftad, Engelska, 2019
2 286 kr
Skickas inom 10-15 vardagar
This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held in Kunming, China, from 20 to 22 July 2019, it is a useful resource for researchers, including professors and graduate students, as well as R&D staff in industry.
Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery
Volume 1
AvZhengtao Yu,Liang Zhaom. fl.
E-bok
Engelska, 2019
2 917 kr
Läs direkt efter köp
This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held in Kunming, China, from 20 to 22 July 2019, it is a useful resource for researchers, including professors and graduate students, as well as R&D staff in industry.
Del 1075 - Advances in Intelligent Systems and Computing
Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery
Volume 2
AvYong Liu,Lipo Wangm. fl.
Häftad, Engelska, 2019
2 855 kr
Skickas inom 10-15 vardagar
This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held in Kunming, China, from 20 to 22 July 2019, it is a useful resource for researchers, including professors and graduate students, as well as R&D staff in industry.
Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery
Volume 2
AvZhengtao Yu,Liang Zhaom. fl.
E-bok
Engelska, 2019
3 567 kr
Läs direkt efter köp
This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held in Kunming, China, from 20 to 22 July 2019, it is a useful resource for researchers, including professors and graduate students, as well as R&D staff in industry.
Advances in Innovative Geotechnical Engineering
Proceedings of the 6th GeoChina International Conference on Civil & Transportation Infrastructures: From Engineering to Smart & Green Life Cycle Solutions -- Nanchang, China, 2021
AvYong Liu,Sabatino Cuomom. fl.
Häftad, Engelska, 2021
1 888 kr
Skickas inom 10-15 vardagar
With the development of social and science, new requirements are put forward for geotechnical engineering. Advanced geotechnical techniques were proposed to solve the new challenges in geotechnical engineering. The articles presented in this volume aim to the new development of geotechnical engineering such as characterization of geomaterials, slope stability, application of environmental protection materials and some other geotechnical issues that are becoming quite relevant in today's world.
Advances in Innovative Geotechnical Engineering
Proceedings of the 6th GeoChina International Conference on Civil & Transportation Infrastructures: From Engineering to Smart & Green Life Cycle Solutions -- Nanchang, China, 2021
AvJunsheng Yang,Sabatino Cuomom. fl.
E-bok
Engelska, 2021
2 384 kr
Läs direkt efter köp
With the development of social and science, new requirements are put forward for geotechnical engineering. Advanced geotechnical techniques were proposed to solve the new challenges in geotechnical engineering. The articles presented in this volume aim to the new development of geotechnical engineering such as characterization of geomaterials, slope stability, application of environmental protection materials and some other geotechnical issues that are becoming quite relevant in today''s world.
Value in Business
A Holistic, Systems-based Approach to Creating and Achieving Value
AvJeffrey Yi-Lin Forrest,Yong Liu
Inbunden, Engelska, 2021
1 602 kr
Skickas inom 10-15 vardagar
This book uses a system-based approach to decipher and organize the concepts and conclusions relevant for creating and capturing value in business. It develops a scientific theory based on systems science and logical reasoning that is commonly employed in mathematics and natural science. The resulting new theory focuses on the organizational nature of the world and the organic and holistic feature of human organizations and their interactions. To this end, this book identifies a few axioms, instead of empirical discoveries, on which it reliably constructs the entire theory.

Yong Liu – författare

Melt Electrospinning

Melt Electrospinning

Quality of Service in Optical Burst Switched Networks

Quality of Service in Optical Burst Switched Networks

New Polymeric Products

New Polymeric Products

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly

Machine Learning in Capacitive Deionization

Quality of Service in Optical Burst Switched Networks

Power Electronic Packaging

Power Electronic Packaging

Power Electronic Packaging

Wafer-Level Chip-Scale Packaging

Wafer-Level Chip-Scale Packaging

Wafer-Level Chip-Scale Packaging

Snow Without Trace: Postwar Experience of a Korean War Volunteer Soldier

Practical Deep Learning at Scale with MLflow

Stochastic Network Calculus

Stochastic Network Calculus

Stochastic Network Calculus

3D Cinematic Aesthetics and Storytelling

Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

Advances in Innovative Geotechnical Engineering

Advances in Innovative Geotechnical Engineering

Value in Business