Shichun Qu – författare

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3 produkter

1. 

   Wafer-Level Chip-Scale Packaging

   Analog and Power Semiconductor Applications

   Av Shichun Qu, Yong Liu

   Inbunden, 2014

   1738 kr

   Lägg i varukorg

   Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog …

2. 

   Wafer-Level Chip-Scale Packaging

   Analog and Power Semiconductor Applications

   Av Yong Liu, Shichun Qu

   E-bok, 2014

   2217 kr

   Lägg i varukorg

   Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog …

3. 

   Wafer-Level Chip-Scale Packaging

   Analog and Power Semiconductor Applications

   Av Shichun Qu, Yong Liu

   Häftad, 2016

   1738 kr

   Lägg i varukorg

   Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog …