Shen Liu – författare

Due to the scale and complexity of data sets currently being collected in areas such as health, transportation, environmental science, engineering, information technology, business and finance, modern quantitative analysts are seeking improved and appropriate computational and statistical methods to explore, model and draw inferences from big data. This book aims to introduce suitable approaches for such endeavours, providing applications and case studies for the purpose of demonstration.Computational and Statistical Methods for Analysing Big Data with Applications starts with an overview of the era of big data. It then goes onto explain the computational and statistical methods which have been commonly applied in the big data revolution. For each of these methods, an example is provided as a guide to its application. Five case studies are presented next, focusing on computer vision with massive training data, spatial data analysis, advanced experimental design methods for big data, big data in clinical medicine, and analysing data collected from mobile devices, respectively. The book concludes with some final thoughts and suggested areas for future research in big data.- Advanced computational and statistical methodologies for analysing big data are developed- Experimental design methodologies are described and implemented to make the analysis of big data more computationally tractable- Case studies are discussed to demonstrate the implementation of the developed methods- Five high-impact areas of application are studied: computer vision, geosciences, commerce, healthcare and transportation- Computing code/programs are provided where appropriate

Due to the scale and complexity of data sets currently being collected in areas such as health, transportation, environmental science, engineering, information technology, business and finance, modern quantitative analysts are seeking improved and appropriate computational and statistical methods to explore, model and draw inferences from big data. This book aims to introduce suitable approaches for such endeavours, providing applications and case studies for the purpose of demonstration.

Computational and Statistical Methods for Analysing Big Data with Applications starts with an overview of the era of big data. It then goes onto explain the computational and statistical methods which have been commonly applied in the big data revolution. For each of these methods, an example is provided as a guide to its application. Five case studies are presented next, focusing on computer vision with massive training data, spatial data analysis, advanced experimental design methods for big data, big data in clinical medicine, and analysing data collected from mobile devices, respectively. The book concludes with some final thoughts and suggested areas for future research in big data.

Advanced computational and statistical methodologies for analysing big data are developed Experimental design methodologies are described and implemented to make the analysis of big data more computationally tractable Case studies are discussed to demonstrate the implementation of the developed methods Five high-impact areas of application are studied: computer vision, geosciences, commerce, healthcare and transportation Computing code/programs are provided where appropriate

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.   Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion websiteLiu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.   Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book''s companion website

Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testingFocuses on the design of LED packaging and its applications such as road lightsIncludes design methods and experiences necessary for LED engineers, especially optical and thermal designIntroduces novel LED packaging structures and manufacturing processes, such as ASLPCovers reliability considerations, the most challenging problem for the LED industryProvides measurement and testing standards, which are critical for LED development, for both LED and LED fixturesCodes and demonstrations available from the book’s Companion WebsiteThis book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production.Color version of selected figures can be found at www.wiley.com/go/liu/led

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives.

In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products.

One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website

This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production.

Color version of selected figures can be found at www.wiley.com/go/liu/led

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives.

In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products.

One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website

This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production.

Color version of selected figures can be found at www.wiley.com/go/liu/led

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.   Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book''s companion website

Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

A practical introduction to state-of-the-art freeform optics design for LED packages and applicationsBy affording designers the freedom to create complex, aspherical optical surfaces with minimal or no aberrations, freeform design transcends the constraints imposed by hundreds of years of optics design and fabrication. Combining unprecedented design freedom with precise light irradiation control, freeform optics design is also revolutionizing the design and manufacture of high quality LED lighting. The first and only book of its kind, Freeform Optics for LED Packages and Applications helps put readers at the forefront of the freeform optics revolution.Designed to function as both an authoritative review of the current state of the industry and a practical introduction to advanced optical design for LED lighting, this book makes learning and mastering freeform optics skills simpler and easier than ever before with: Real-world examples and case studies systematically describing an array of algorithms and designs—from new freeform algorithms to design methods to advanced optical designsCoding for all freeform optics algorithms covered—makes it easier and more convenient to start developing points of freeform optics and construct lenses or reflectors, right awayCase studies of a range of products, including designs for a freeform optics LED bulb, an LED spotlight, LED street lights, an LED BLU, and many more Freeform Optics for LED Packages and Applications is must-reading for optical design engineers and LED researchers, as well as advanced-level students with an interest in LED lighting. It is also an indispensable working resource design practitioners within the LED lighting industry.

A practical introduction to state-of-the-art freeform optics design for LED packages and applications

By affording designers the freedom to create complex, aspherical optical surfaces with minimal or no aberrations, freeform design transcends the constraints imposed by hundreds of years of optics design and fabrication. Combining unprecedented design freedom with precise light irradiation control, freeform optics design is also revolutionizing the design and manufacture of high quality LED lighting. The first and only book of its kind, Freeform Optics for LED Packages and Applications helps put readers at the forefront of the freeform optics revolution.

Designed to function as both an authoritative review of the current state of the industry and a practical introduction to advanced optical design for LED lighting, this book makes learning and mastering freeform optics skills simpler and easier than ever before with:

Real-world examples and case studies systematically describing an array of algorithms and designs—from new freeform algorithms to design methods to advanced optical designs Coding for all freeform optics algorithms covered—makes it easier and more convenient to start developing points of freeform optics and construct lenses or reflectors, right away Case studies of a range of products, including designs for a freeform optics LED bulb, an LED spotlight, LED street lights, an LED BLU, and many more 

Freeform Optics for LED Packages and Applications is must-reading for optical design engineers and LED researchers, as well as advanced-level students with an interest in LED lighting. It is also an indispensable working resource design practitioners within the LED lighting industry.

A practical introduction to state-of-the-art freeform optics design for LED packages and applications

By affording designers the freedom to create complex, aspherical optical surfaces with minimal or no aberrations, freeform design transcends the constraints imposed by hundreds of years of optics design and fabrication. Combining unprecedented design freedom with precise light irradiation control, freeform optics design is also revolutionizing the design and manufacture of high quality LED lighting. The first and only book of its kind, Freeform Optics for LED Packages and Applications helps put readers at the forefront of the freeform optics revolution.

Designed to function as both an authoritative review of the current state of the industry and a practical introduction to advanced optical design for LED lighting, this book makes learning and mastering freeform optics skills simpler and easier than ever before with:

Real-world examples and case studies systematically describing an array of algorithms and designs—from new freeform algorithms to design methods to advanced optical designs Coding for all freeform optics algorithms covered—makes it easier and more convenient to start developing points of freeform optics and construct lenses or reflectors, right away Case studies of a range of products, including designs for a freeform optics LED bulb, an LED spotlight, LED street lights, an LED BLU, and many more 

Freeform Optics for LED Packages and Applications is must-reading for optical design engineers and LED researchers, as well as advanced-level students with an interest in LED lighting. It is also an indispensable working resource design practitioners within the LED lighting industry.

Biofabrication for Orthopedics A comprehensive overview of biofabrication techniques for orthopedics and their novel applications With an ever-increasing global population and the rise in the occurrence of orthopedic diseases amongst an aging population, it is essential for technological advances to meet this growing medical need. Orthopedic biofabrication is a cutting-edge field that seeks to produce novel clinical solutions to this mounting problem, through the incorporation of revolutionary technologies that have the potential to not only transform healthcare, but also provide highly automated and personalized patient solutions. With the advances in the discipline, there is a significant growing interest in biofabrication for orthopedics in research activity geared towards routine clinical use. Ideal for a broad readership amongst medical practitioners and scientists, Biofabrication for Orthopedics summarizes all aspects of the topic: detailed information on the technology, along with advanced developments, research progress, and future perspectives on biofabrication for orthopaedics—particularly on the potential applications for tissue engineering technologies. In doing so, the book describes the various biomaterials—natural and synthetic—use for orthopedics and discusses the many ways in which these materials can be used in all parts of the body. As such, it offers detailed information on a wide range of applications in the fields of biology and clinical and industrial manufacturing. Biofabrication for Orthopedics readers will also find: Insights into the applications of biofabrication technologies in various bodily functionsThorough discussion of different biofabrication techniques used in creating orthopedic products, like stereolithography, cell sheet and organ bioprinting, electrospinning, and microfluidicsDiscussion of a wide range of diverse functions, such as bone implants, skin regeneration, vascularization, meniscus remodeling, and moreBiofabrication for Orthopedics is a useful reference for those in a variety of research fields like medical-related practitioners and scientists, materials science, medicine, and manufacturing, as well as the libraries who support them.

Biofabrication for Orthopedics

A comprehensive overview of biofabrication techniques for orthopedics and their novel applications

With an ever-increasing global population and the rise in the occurrence of orthopedic diseases amongst an aging population, it is essential for technological advances to meet this growing medical need. Orthopedic biofabrication is a cutting-edge field that seeks to produce novel clinical solutions to this mounting problem, through the incorporation of revolutionary technologies that have the potential to not only transform healthcare, but also provide highly automated and personalized patient solutions. With the advances in the discipline, there is a significant growing interest in biofabrication for orthopedics in research activity geared towards routine clinical use.

Ideal for a broad readership amongst medical practitioners and scientists, Biofabrication for Orthopedics summarizes all aspects of the topic: detailed information on the technology, along with advanced developments, research progress, and future perspectives on biofabrication for orthopaedics—particularly on the potential applications for tissue engineering technologies. In doing so, the book describes the various biomaterials—natural and synthetic—use for orthopedics and discusses the many ways in which these materials can be used in all parts of the body. As such, it offers detailed information on a wide range of applications in the fields of biology and clinical and industrial manufacturing.

Biofabrication for Orthopedics readers will also find:

Insights into the applications of biofabrication technologies in various bodily functions Thorough discussion of different biofabrication techniques used in creating orthopedic products, like stereolithography, cell sheet and organ bioprinting, electrospinning, and microfluidics Discussion of a wide range of diverse functions, such as bone implants, skin regeneration, vascularization, meniscus remodeling, and more

Biofabrication for Orthopedics is a useful reference for those in a variety of research fields like medical-related practitioners and scientists, materials science, medicine, and manufacturing, as well as the libraries who support them.

Biofabrication for Orthopedics

A comprehensive overview of biofabrication techniques for orthopedics and their novel applications

With an ever-increasing global population and the rise in the occurrence of orthopedic diseases amongst an aging population, it is essential for technological advances to meet this growing medical need. Orthopedic biofabrication is a cutting-edge field that seeks to produce novel clinical solutions to this mounting problem, through the incorporation of revolutionary technologies that have the potential to not only transform healthcare, but also provide highly automated and personalized patient solutions. With the advances in the discipline, there is a significant growing interest in biofabrication for orthopedics in research activity geared towards routine clinical use.

Ideal for a broad readership amongst medical practitioners and scientists, Biofabrication for Orthopedics summarizes all aspects of the topic: detailed information on the technology, along with advanced developments, research progress, and future perspectives on biofabrication for orthopaedics—particularly on the potential applications for tissue engineering technologies. In doing so, the book describes the various biomaterials—natural and synthetic—use for orthopedics and discusses the many ways in which these materials can be used in all parts of the body. As such, it offers detailed information on a wide range of applications in the fields of biology and clinical and industrial manufacturing.

Biofabrication for Orthopedics readers will also find:

Insights into the applications of biofabrication technologies in various bodily functions Thorough discussion of different biofabrication techniques used in creating orthopedic products, like stereolithography, cell sheet and organ bioprinting, electrospinning, and microfluidics Discussion of a wide range of diverse functions, such as bone implants, skin regeneration, vascularization, meniscus remodeling, and more

Biofabrication for Orthopedics is a useful reference for those in a variety of research fields like medical-related practitioners and scientists, materials science, medicine, and manufacturing, as well as the libraries who support them.