ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS

AvHao Yu,Chuan-Seng Tan

Häftad, Engelska, 2015

Del 1 i serien SERIES ON EMERGING TECHNOLOGIES IN CIRCUITS AND SYSTEMS

780 kr

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Beskrivning

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Produktinformation

Utgivningsdatum:2015-10-16
Mått:230 x 155 x 22 mm
Vikt:562 g
Format:Häftad
Språk:Engelska
Serie:SERIES ON EMERGING TECHNOLOGIES IN CIRCUITS AND SYSTEMS
Antal sidor:392
Förlag:World Scientific Publishing Co Pte Ltd
ISBN:9789814699013

Utforska kategorier

Elektronik och kommunikationer inom Naturvetenskap och teknik

Innehållsförteckning

TSV and TSI Device Fabrication; Device Modeling; Macromodeling; Power and Thermal Integrity; Power Ground Design; Clock-Tree Design; 3D IC Test; Compressive Sensing and Data Recovery; Power and Thermal Modeling; Microfludic Based Thermal Management; Power I/O Management; Signal I/O Bandwidth Management; Q-Learning; Signal I/O Voltage-Swing Management; 3D Sensor Design; CMOS Readout Circuit; I/O Buffer Design; I/O with Clock-Data Recovery; Multi-Core Microprocessor Design; Non-Volatile Memory;