Hao Yu – författare

Flexible Distribution Networks facilitates the enhanced flexibility, efficiency and reliability of distribution networks under complex operating environments delivered by high DG penetration. Considering the high share of DG and flexibility improvement brought by SOP-type power electronic devices, the work aims to solve the issues of optimal operation of flexible distribution networks. Technical solutions for flexible operation problems of FDN are discussed in depth, including efficient analytical methods with high penetration of DG, SOP-based optimal operation methods with uncertainty, and high-performance convex optimization algorithms.

Readers will develop sound knowledge and gain insights into the optimal operation of FDN with high penetration of DG.

Provides efficient operation analysis methods for FDN with high penetration of distributed generators Proposes measurement-based network estimation methods to improve the observability of network states Develops SOP-based optimal operation methods to facilitate the flexible operation of FDN under complex and uncertain environments Expounds local control frameworks to realize the rapid and effective implementation of flexible operation strategies Reviews high-performance convex optimization methods to realize the efficient solving of optimal operation problems in FDN

Given the importance of human centricity, resilience, and sustainability, the emerging concept of Industry 5.0 has pushed forward the research frontier of the technology-focused Industry 4.0 to a smart and harmonious socio-economic transition driven by both humans and technologies, where the role of the human in the technological transformation is predominantly focused on. Compared with Industry 4.0, smart logistics in Industry 5.0 puts more focus on the interaction between humans and technology in the digital transition with the increasing adoption of collaborative technologies, e.g., human-machine systems, collaborative robots, and human-robot collaboration.In this book, a comprehensive overview on how technological enablers will help the smart and sustainable transition of logistics planning and operations is provided. Specifically, the book focuses on the conceptual development and framework of smart logistics transformation in Industry 5.0, smart and sustainable logistics planning and operations, smart manufacturing logistics and warehousing, data-driven smart logistics and transportation, digital twin of logistics systems, and smart reverse logistics transformation. Most importantly, the role of humans in the smart logistics transformation is predominantly focused on in this book.

Along with numerous opportunities in communication and imaging applications, the design of emerging millimeter-wave (mm-wave) and terahertz (THz) electronic circuits and systems in CMOS technology faces new challenges and requires new devices. Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials provides alternative solutions using CMOS on-chip metamaterials. Unlike conventional metamaterial devices on printed circuit boards (PCBs), the presented CMOS metamaterials can be utilized to build many mm-wave and THz circuits and systems on chip.Leveraging the authors’ extensive expertise and experience with CMOS on-chip metamaterials, this book shows that with the use of metamaterials, one can realize coherent THz signal generation, amplification, transmission, and detection of phase-arrayed CMOS transistors with significantly improved performance. Offering detailed coverage from device to system, the book hereby:Describes integrated circuit design with application of metamaterials in CMOS technologyIncludes real CMOS integrated circuit examples and chip demonstrations with measurement resultsEvaluates novel mm-wave and THz communication and imaging systems under CMOS-based system-on-chip integrationDesign of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials reflects the latest research progress and provides a state-of-the-art reference on CMOS-based metamaterial devices and mm-wave and THz systems.

Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have  become imperative for the successful design of VLSI chips.This book provides readers with tools for variation-aware design methodologies and computer-aided design (CAD) of VLSI systems, in the presence of process variations at the nanometer scale. It presents the latest developments for modeling and analysis, with a focus on statistical interconnect modeling, statistical parasitic extractions, statistical full-chip leakage and dynamic power analysis considering spatial correlations, statistical analysis and modeling for large global interconnects and analog/mixed-signal circuits.  Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits;Helps chip designers understand the potential and limitations of their design tools, improving their design productivity;Presents analysis of each algorithm with practical applications in the context of real circuit design;Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.  Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits;Helps chip designers understand the potential and limitations of their design tools, improving their design productivity;Presents analysis of each algorithm with practical applications in thecontext of real circuit design;Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.

Along with numerous opportunities in communication and imaging applications, the design of emerging millimeter-wave (mm-wave) and terahertz (THz) electronic circuits and systems in CMOS technology faces new challenges and requires new devices. Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials provides alternative solutions using CMOS on-chip metamaterials. Unlike conventional metamaterial devices on printed circuit boards (PCBs), the presented CMOS metamaterials can be utilized to build many mm-wave and THz circuits and systems on chip.Leveraging the authors’ extensive expertise and experience with CMOS on-chip metamaterials, this book shows that with the use of metamaterials, one can realize coherent THz signal generation, amplification, transmission, and detection of phase-arrayed CMOS transistors with significantly improved performance. Offering detailed coverage from device to system, the book hereby:Describes integrated circuit design with application of metamaterials in CMOS technologyIncludes real CMOS integrated circuit examples and chip demonstrations with measurement resultsEvaluates novel mm-wave and THz communication and imaging systems under CMOS-based system-on-chip integrationDesign of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials reflects the latest research progress and provides a state-of-the-art reference on CMOS-based metamaterial devices and mm-wave and THz systems.

Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have  become imperative for the successful design of VLSI chips.This book provides readers with tools for variation-aware design methodologies and computer-aided design (CAD) of VLSI systems, in the presence of process variations at the nanometer scale. It presents the latest developments for modeling and analysis, with a focus on statistical interconnect modeling, statistical parasitic extractions, statistical full-chip leakage and dynamic power analysis considering spatial correlations, statistical analysis and modeling for large global interconnects and analog/mixed-signal circuits.  Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits;Helps chip designers understand the potential and limitations of their design tools, improving their design productivity;Presents analysis of each algorithm with practical applications in the context of real circuit design;Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.  Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits;Helps chip designers understand the potential and limitations of their design tools, improving their design productivity;Presents analysis of each algorithm with practical applications in thecontext of real circuit design;Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.

This book presents the latest techniques for characterization, modeling and design for nano-scale non-volatile memory (NVM) devices. Coverage focuses on fundamental NVM device fabrication and characterization, internal state identification of memristic dynamics with physics modeling, NVM circuit design and hybrid NVM memory system design-space optimization. The authors discuss design methodologies for nano-scale NVM devices from a circuits/systems perspective, including the general foundations for the fundamental memristic dynamics in NVM devices. Coverage includes physical modeling, as well as the development of a platform to explore novel hybrid CMOS and NVM circuit and system design.• Offers readers a systematic and comprehensive treatment of emerging nano-scale non-volatile memory (NVM) devices;• Focuses on the internal state of NVM memristic dynamics, novel NVM readout and memory cell circuit design and hybrid NVM memory system optimization;• Provides both theoretical analysis and practical examples to illustrate design methodologies;• Illustrates design and analysis for recent developments in spin-toque-transfer, domain-wall racetrack and memristors.

This volume reviews and summarizes some of A. I. McLeod's significant contributions to time series analysis. It also contains original contributions to the field and to related areas by participants of the festschrift held in June 2014 and friends of Dr. McLeod. Covering a diverse range of state-of-the-art topics, this volume well balances applied and theoretical research across fourteen contributions by experts in the field. It will be of interest to researchers and practitioners in time series, econometricians, and graduate students in time series or econometrics, as well as environmental statisticians, data scientists, statisticians interested in graphical models, and researchers in quantitative risk management.

It will be of interest to researchers and practitioners in time series, econometricians, and graduate students in time series or econometrics, as well as environmental statisticians, data scientists, statisticians interested in graphical models, and researchers in quantitative risk management.

The transition towards exascale computing has resulted in major transformations in computing paradigms. The need to analyze and respond to such large amounts of data sets has led to the adoption of machine learning (ML) and deep learning (DL) methods in a wide range of applications.One of the major challenges is the fetching of data from computing memory and writing it back without experiencing a memory-wall bottleneck. To address such concerns, in-memory computing (IMC) and supporting frameworks have been introduced. In-memory computing methods have ultra-low power and high-density embedded storage. Resistive Random-Access Memory (ReRAM) technology seems the most promising IMC solution due to its minimized leakage power, reduced power consumption and smaller hardware footprint, as well as its compatibility with CMOS technology, which is widely used in industry.In this book, the authors introduce ReRAM techniques for performing distributed computing using IMC accelerators, present ReRAM-based IMC architectures that can perform computations of ML and data-intensive applications, as well as strategies to map ML designs onto hardware accelerators.The book serves as a bridge between researchers in the computing domain (algorithm designers for ML and DL) and computing hardware designers.

Exa-scale computing needs to re-examine the existing hardware platform that can support intensive data-oriented computing. As a result, by utilizing spintronics, in-memory-based computing has been applied for data encryption and machine learning.

This book describes the current state of the art in big-data analytics, from a technology and hardware architecture perspective. The presentation is designed to be accessible to a broad audience, with general knowledge of hardware design and some interest in big-data analytics. Coverage includes emerging technology and devices for data-analytics, circuit design for data-analytics, and architecture and algorithms to support data-analytics. Readers will benefit from the realistic context used by the authors, which demonstrates what works, what doesn’t work, and what are the fundamental problems, solutions, upcoming challenges and opportunities.Provides a single-source reference to hardware architectures for big-data analytics;Covers various levels of big-data analytics hardware design abstraction and flow, from device, to circuits and systems;Demonstrates how non-volatile memory (NVM) based hardware platforms can be a viable solution to existing challenges in hardware architecture for big-data analytics.

This book describes the current state of the art in big-data analytics, from a technology and hardware architecture perspective. The presentation is designed to be accessible to a broad audience, with general knowledge of hardware design and some interest in big-data analytics. Coverage includes emerging technology and devices for data-analytics, circuit design for data-analytics, and architecture and algorithms to support data-analytics. Readers will benefit from the realistic context used by the authors, which demonstrates what works, what doesn’t work, and what are the fundamental problems, solutions, upcoming challenges and opportunities.Provides a single-source reference to hardware architectures for big-data analytics;Covers various levels of big-data analytics hardware design abstraction and flow, from device, to circuits and systems;Demonstrates how non-volatile memory (NVM) based hardware platforms can be a viable solution to existing challenges in hardware architecture for big-data analytics.

This book gathers invited presentations from the 2nd Symposium of the ICSA- CANADA Chapter held at the University of Calgary from August 4-6, 2015. The aim of this Symposium was to promote advanced statistical methods in big-data sciences and to allow researchers to exchange ideas on statistics and data science and to embraces the challenges and opportunities of statistics and data science in the modern world.  It addresses diverse themes in advanced statistical analysis in big-data sciences, including methods for administrative data analysis, survival data analysis, missing data analysis, high-dimensional and genetic data analysis, longitudinal and functional data analysis, the design and analysis of studies with response-dependent and multi-phase designs, time series and robust statistics, statistical inference based on likelihood, empirical likelihood and estimating functions. The editorial group selected 14 high-quality presentations from this successful symposium and invitedthe presenters to prepare a full chapter for this book in order to disseminate the findings and promote further research collaborations in this area. This timely book offers new methods that impact advanced statistical model development in big-data sciences.

This book gathers invited presentations from the 2nd Symposium of the ICSA- CANADA Chapter held at the University of Calgary from August 4-6, 2015. The aim of this Symposium was to promote advanced statistical methods in big-data sciences and to allow researchers to exchange ideas on statistics and data science and to embraces the challenges and opportunities of statistics and data science in the modern world.  It addresses diverse themes in advanced statistical analysis in big-data sciences, including methods for administrative data analysis, survival data analysis, missing data analysis, high-dimensional and genetic data analysis, longitudinal and functional data analysis, the design and analysis of studies with response-dependent and multi-phase designs, time series and robust statistics, statistical inference based on likelihood, empirical likelihood and estimating functions. The editorial group selected 14 high-quality presentations from this successful symposium and invitedthe presenters to prepare a full chapter for this book in order to disseminate the findings and promote further research collaborations in this area. This timely book offers new methods that impact advanced statistical model development in big-data sciences.

This book presents the latest techniques for machine learning based data analytics on IoT edge devices. The authors also discuss hardware architecture design with coverage focusing on both CMOS based computing systems and the new emerging Resistive Random-Access Memory (RRAM) based systems.

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.