- 10% rabatt på allt
3D Integration for VLSI Systems
AvSteven J. Koester,Kuan-Neng Chen
E-bok
PDF, Engelska, 20161 928 kr
Läs direkt i Bokus Reader – eller ladda ned till din enhet (PDF kräver ofta zoom och scroll på små skärmar).
Beskrivning
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Produktinformation
Utforska kategorier
Hoppa över listan
Du kanske också är intresserad av
3D Integration for VLSI Systems
Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Inbunden, 2011
1 653 kr
ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)
BAR-COHEN AVRAM, Pengli Zhu, Gang Li, C P Wong, Dae Young Jung, Stephen R Cain, William (Bill) T Chen, Bahgat G Sammakia, Muhannad S Bakir, Suresh K Sitaraman, Kuan-Neng Chen, Chuan Seng Tan
Inbunden, 2019
22 007 kr
Wafer Level 3-D ICs Process Technology
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
Häftad, 2010
1 656 kr
Wafer Level 3-D ICs Process Technology
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
Inbunden, 2008
1 656 kr
Wafer Level 3-D ICs Process Technology
L. Rafael Reif, Ronald J. Gutmann, Chuan Seng Tan
E-bok
20092 044 kr
Del 1