3D Integration for VLSI Systems

E-bok

PDF, Engelska, 2016

1 928 kr

Läs direkt i Bokus Reader – eller ladda ned till din enhet (PDF kräver ofta zoom och scroll på små skärmar).

Beskrivning

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Produktinformation

Utgivningsdatum:2016-04-19
Språk:Engelska
Filformat:PDF
Kopieringsskydd:LCP
ISBN:9789814303828
Förlag:Taylor and Francis Group

Utforska kategorier

Du kanske också är intresserad av

3D Integration for VLSI Systems

Steven J. Koester, Kuan-Neng Chen, Chuan Seng Tan

E-bok

2016

1 928 kr

3D Integration for VLSI Systems

Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester

Inbunden, 2011

1 630 kr

ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

BAR-COHEN AVRAM, Pengli Zhu, Gang Li, C P Wong, Dae Young Jung, Stephen R Cain, William (Bill) T Chen, Bahgat G Sammakia, Muhannad S Bakir, Suresh K Sitaraman, Kuan-Neng Chen, Chuan Seng Tan