Kuan-Neng Chen – författare

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4 produkter

1. 

   3D Integration for VLSI Systems

   Av Steven J. Koester, Kuan-Neng Chen m. fl.

   E-bok, 2016

   1991 kr

   Lägg i varukorg

   Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they …

2. 

   ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

   Av BAR-COHEN AVRAM, Pengli Zhu m. fl.

   Inbunden, 2019

   22337 kr

   Lägg i varukorg

   Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of …

3. 

   3D Integration for VLSI Systems

   Av Chuan Seng Tan, Kuan-Neng Chen m. fl.

   Inbunden, 2011

   1675 kr

   Lägg i varukorg

   Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they …

4. 

   3D Integration for VLSI Systems

   Av Steven J. Koester, Kuan-Neng Chen m. fl.

   E-bok, 2016

   1991 kr

   Lägg i varukorg

   Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they …