3D Integration for VLSI Systems

"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA

• 3D Integration Technology – Introduction and Overview. A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For? Wafer Bonding Techniques. TSV Etching. TSV Filling. 3D Technology Platform: Temporary Bonding and Release. 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling. Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology. Advanced Direct Bond Technology. Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration. Through Silicon Via Implementation in CMOS Image Sensor Product. A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding. Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells. Thermal-Aware 3D IC Designs. 3D IC Design Automation Considering Dynamic Power and Thermal Integrity. Outlook.