BAR-COHEN AVRAM – författare

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3 produkter

1. 

   ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

   Av BAR-COHEN AVRAM, Pengli Zhu m. fl.

   Inbunden, 2019

   22007 kr

   Lägg i varukorg

   Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of …

2. 

   Encyclopedia of Thermal Packaging

   Set 3: Thermal Packaging Applications: (A 3–Volume Set)

   Av BAR-COHEN AVRAM, Avram Bar-Cohen

   Inbunden, 2018

   19613 kr

   Lägg i varukorg

   Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past …

3. 

   ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET)

   Av BAR-COHEN AVRAM, Avram Bar-Cohen

   Inbunden, 2013

   23266 kr

   Tillfälligt slut

   This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit and /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional …