Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun Microsystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy. Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design. He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com ) Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith. He was the recipient of the 2016 Engineer of the Year Award from DesignCon. He can be reached at eric@beTheSignal.com.

• Preface to the Third Edition     xixPreface to the Second Edition     xxiPreface to the First Edition     xxiii Chapter 1  Signal Integrity Is in Your Future     1 1.1  What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?     3 1.2  Signal-Integrity Effects on One Net     7 1.3  Cross Talk     11 1.4  Rail-Collapse Noise     14 1.5  Electromagnetic Interference (EMI)     17 1.6  Two Important Signal-Integrity Generalizations     19 1.7  Trends in Electronic Products     20 1.8  The Need for a New Design Methodology     26 1.9  A New Product Design Methodology     27 1.10  Simulations     29 1.11  Modeling and Models     34 1.12  Creating Circuit Models from Calculation     36 1.13  Three Types of Measurements     42 1.14  The Role of Measurements     45 1.15  The Bottom Line     48 Review Questions     50 Chapter 2  Time and Frequency Domains     51 2.1  The Time Domain     52 2.2  Sine Waves in the Frequency Domain     54 2.3  Shorter Time to a Solution in the Frequency Domain     56 2.4  Sine-Wave Features     58 2.5  The Fourier Transform     60 2.6  The Spectrum of a Repetitive Signal     62 2.7  The Spectrum of an Ideal Square Wave     64 2.8  From the Frequency Domain to the Time Domain     66 2.9  Effect of Bandwidth on Rise Time     68 2.10  Bandwidth and Rise Time     72 2.11  What Does Significant Mean?     73 2.12  Bandwidth of Real Signals     77 2.13  Bandwidth and Clock Frequency     78 2.14  Bandwidth of a Measurement     80 2.15  Bandwidth of a Model     83 2.16  Bandwidth of an Interconnect     85 2.17  The Bottom Line     89 Review Questions     90 Chapter 3  Impedance and Electrical Models     93 3.1  Describing Signal-Integrity Solutions in Terms of Impedance     94 3.2  What Is Impedance?     97 3.3  Real Versus Ideal Circuit Elements     99 3.4  Impedance of an Ideal Resistor in the Time Domain     102 3.5  Impedance of an Ideal Capacitor in the Time Domain     103 3.6  Impedance of an Ideal Inductor in the Time Domain     107 3.7  Impedance in the Frequency Domain     109 3.8  Equivalent Electrical Circuit Models     115 3.9  Circuit Theory and SPICE     117 3.10  Introduction to Measurement-Based Modeling     121 3.11  The Bottom Line     126 Review Questions     128 Chapter 4  The Physical Basis of Resistance     131 4.1  Translating Physical Design into Electrical Performance     132 4.2  The Only Good Approximation for the Resistance of Interconnects     133

Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun Microsystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy. Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design. He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com ) Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith. He was the recipient of the 2016 Engineer of the Year Award from DesignCon. He can be reached at eric@beTheSignal.com.

• Preface to the Third Edition     xixPreface to the Second Edition     xxiPreface to the First Edition     xxiii Chapter 1  Signal Integrity Is in Your Future     1 1.1  What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?     3 1.2  Signal-Integrity Effects on One Net     7 1.3  Cross Talk     11 1.4  Rail-Collapse Noise     14 1.5  Electromagnetic Interference (EMI)     17 1.6  Two Important Signal-Integrity Generalizations     19 1.7  Trends in Electronic Products     20 1.8  The Need for a New Design Methodology     26 1.9  A New Product Design Methodology     27 1.10  Simulations     29 1.11  Modeling and Models     34 1.12  Creating Circuit Models from Calculation     36 1.13  Three Types of Measurements     42 1.14  The Role of Measurements     45 1.15  The Bottom Line     48 Review Questions     50 Chapter 2  Time and Frequency Domains     51 2.1  The Time Domain     52 2.2  Sine Waves in the Frequency Domain     54 2.3  Shorter Time to a Solution in the Frequency Domain     56 2.4  Sine-Wave Features     58 2.5  The Fourier Transform     60 2.6  The Spectrum of a Repetitive Signal     62 2.7  The Spectrum of an Ideal Square Wave     64 2.8  From the Frequency Domain to the Time Domain     66 2.9  Effect of Bandwidth on Rise Time     68 2.10  Bandwidth and Rise Time     72 2.11  What Does Significant Mean?     73 2.12  Bandwidth of Real Signals     77 2.13  Bandwidth and Clock Frequency     78 2.14  Bandwidth of a Measurement     80 2.15  Bandwidth of a Model     83 2.16  Bandwidth of an Interconnect     85 2.17  The Bottom Line     89 Review Questions     90 Chapter 3  Impedance and Electrical Models     93 3.1  Describing Signal-Integrity Solutions in Terms of Impedance     94 3.2  What Is Impedance?     97 3.3  Real Versus Ideal Circuit Elements     99 3.4  Impedance of an Ideal Resistor in the Time Domain     102 3.5  Impedance of an Ideal Capacitor in the Time Domain     103 3.6  Impedance of an Ideal Inductor in the Time Domain     107 3.7  Impedance in the Frequency Domain     109 3.8  Equivalent Electrical Circuit Models     115 3.9  Circuit Theory and SPICE     117 3.10  Introduction to Measurement-Based Modeling     121 3.11  The Bottom Line     126 Review Questions     128 Chapter 4  The Physical Basis of Resistance     131 4.1  Translating Physical Design into Electrical Performance     132 4.2  The Only Good Approximation for the Resistance of Interconnects     133

Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun Microsystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy. Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design. He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com ) Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith. He was the recipient of the 2016 Engineer of the Year Award from DesignCon. He can be reached at eric@beTheSignal.com.

• Preface to the Third Edition     xixPreface to the Second Edition     xxiPreface to the First Edition     xxiii Chapter 1  Signal Integrity Is in Your Future     1 1.1  What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?     3 1.2  Signal-Integrity Effects on One Net     7 1.3  Cross Talk     11 1.4  Rail-Collapse Noise     14 1.5  Electromagnetic Interference (EMI)     17 1.6  Two Important Signal-Integrity Generalizations     19 1.7  Trends in Electronic Products     20 1.8  The Need for a New Design Methodology     26 1.9  A New Product Design Methodology     27 1.10  Simulations     29 1.11  Modeling and Models     34 1.12  Creating Circuit Models from Calculation     36 1.13  Three Types of Measurements     42 1.14  The Role of Measurements     45 1.15  The Bottom Line     48 Review Questions     50 Chapter 2  Time and Frequency Domains     51 2.1  The Time Domain     52 2.2  Sine Waves in the Frequency Domain     54 2.3  Shorter Time to a Solution in the Frequency Domain     56 2.4  Sine-Wave Features     58 2.5  The Fourier Transform     60 2.6  The Spectrum of a Repetitive Signal     62 2.7  The Spectrum of an Ideal Square Wave     64 2.8  From the Frequency Domain to the Time Domain     66 2.9  Effect of Bandwidth on Rise Time     68 2.10  Bandwidth and Rise Time     72 2.11  What Does Significant Mean?     73 2.12  Bandwidth of Real Signals     77 2.13  Bandwidth and Clock Frequency     78 2.14  Bandwidth of a Measurement     80 2.15  Bandwidth of a Model     83 2.16  Bandwidth of an Interconnect     85 2.17  The Bottom Line     89 Review Questions     90 Chapter 3  Impedance and Electrical Models     93 3.1  Describing Signal-Integrity Solutions in Terms of Impedance     94 3.2  What Is Impedance?     97 3.3  Real Versus Ideal Circuit Elements     99 3.4  Impedance of an Ideal Resistor in the Time Domain     102 3.5  Impedance of an Ideal Capacitor in the Time Domain     103 3.6  Impedance of an Ideal Inductor in the Time Domain     107 3.7  Impedance in the Frequency Domain     109 3.8  Equivalent Electrical Circuit Models     115 3.9  Circuit Theory and SPICE     117 3.10  Introduction to Measurement-Based Modeling     121 3.11  The Bottom Line     126 Review Questions     128 Chapter 4  The Physical Basis of Resistance     131 4.1  Translating Physical Design into Electrical Performance     132 4.2  The Only Good Approximation for the Resistance of Interconnects     133