Thermal Management Strategies for Electronics

Basics, Applications and Emerging Innovations

Häftad, Engelska, 2027

1 906 kr

Kommande

Beskrivning

Thermal Management Strategies for Electronics: Basics, Applications and Emerging Innovations presents fundamentals and emerging trends in electronics cooling and thermal management. The power density of electronic devices continues to increase due to the continuous integration and miniaturization of chips and electronic components, posing challenges for thermal management of electronic devices. Chapters present fundamentals of electronics cooling and thermal management, including basic concepts in heat transfer. Emerging trends and techniques such as AI chips, power electronics, batteries, wearable devices, data centers, functional materials, additive manufacturing, machine learning, and testing and validation of various cooling solutions are examined. Case studies are included to demonstrate real world applications of these techniques. Detailed explanations of reduced-order thermal models for heat-generating components, fast fluid-thermal coupled models for heat sinks, and dynamic models of phase-change cooling systems, are presented. High level concepts such as the complexities of boundary conditions in engineering conditions are explained to to help readers identify nuanced errors in their work. Thermal Management Strategies for Electronics: Basics, Applications and Emerging Innovations is valuable to thermal engineers and electric engineers within various industry sectors, senior bachelor students, graduate students, and researchers in thermal engineering.

Presents both fundamentals and emerging trends in electronics cooling and thermal management
Demonstrates real-world application of emerging trends such as AI chips and power electronics through case studies, procedures, and protocols
Explains concepts of such as complexities of boundary conditions and paradoxes in thermal management

Produktinformation

Utgivningsdatum:2027-06-01
Mått:152 x 229 x undefined mm
Vikt:450 g
Format:Häftad
Språk:Engelska
Antal sidor:300
Förlag:Elsevier Science
ISBN:9780443456930

Utforska kategorier

Energiteknik inom Naturvetenskap och teknik

Mer om författaren

Based on his long-term accumulation in thermal science (phase-change heat transfer enhancement, microscale heat and mass transfer, multiphase flow) and microfluidics, Prof. Wu has mainly engaged in interdisciplinary research on efficient thermal management of chips/power electronics, electronic devices and data centers, participating in numerous research projects from various national agencies and industry in Sweden and China. He has participated in numerous papers, journals, and books from international publishers such as Springer, CRC Press, Wiley, Royal Society of Chemistry, etc. Dr. Feng is highly experienced in the industry and has carried out projects on thermal management of high-power-density converters and electric vehicles. Dr. Feng has engaged in pumped two-phase cooling and battery thermal management through both experiments and numerical simulations. Prof. Hong is a professor working on the development and application of advanced boiling heat transfer devices in Japan and China. As the project leader or subleader, she has participated in various research projects funded by the government and industry. She has published numerous papers in international journals.

Innehållsförteckning

Part I: Fundamentals of Electronics Cooling1. Introduction to Electronics Cooling2. Thermodynamics and Heat Transfer Basics3. Cooling Mechanisms in ElectronicsPart II: Practical Applications in Electronics Cooling4. Cooling Strategies for AI chips5. Cooling in Power Electronics6. Thermal management in Power Battery7. Cooling in Mobile and Wearable Devices8. Thermal Management in Data CentersPart III: Emerging Trends and Innovations9. Functional Materials and Their Role in Thermal Management10. Additive Manufacturing in Thermal Management11. Machine Learning in Thermal Management12. Thermal Design, Testing and Validation of Cooling SolutionsPart IV: Future Directions and Case Studies13. Next-Generation Cooling Technologies14. Conclusion and Outlook