"Its purposes, which it achieves well, are threefold: to give greater visibility to research work being carried out in the United Kingdom; to provide a model for other doctoral students in computer science; and to serve as a textbook for designers and hardware engineers....The book is well sructured and will serve as an excellent example of good, succinct writing for future doctoral students, as well as demonstrating the author's depth of study of the subject." D.Q.M. Fay, Computing Reviews

• Introduction; 1. Two-dimensional chip design; 2. Three-dimensional chip technology; 3. Three-dimensional circuit topology; 4. Three-dimensional cell tesselation; 5. Three-dimensional abutment system; 6. Abutment system configuration; 7. Abutment system evaluation; Conclusions; Appendices; Index.

"Its purposes, which it achieves well, are threefold: to give greater visibility to research work being carried out in the United Kingdom; to provide a model for other doctoral students in computer science; and to serve as a textbook for designers and hardware engineers....The book is well sructured and will serve as an excellent example of good, succinct writing for future doctoral students, as well as demonstrating the author's depth of study of the subject." D.Q.M. Fay, Computing Reviews

• Introduction; 1. Two-dimensional chip design; 2. Three-dimensional chip technology; 3. Three-dimensional circuit topology; 4. Three-dimensional cell tesselation; 5. Three-dimensional abutment system; 6. Abutment system configuration; 7. Abutment system evaluation; Conclusions; Appendices; Index.

"Its purposes, which it achieves well, are threefold: to give greater visibility to research work being carried out in the United Kingdom; to provide a model for other doctoral students in computer science; and to serve as a textbook for designers and hardware engineers....The book is well sructured and will serve as an excellent example of good, succinct writing for future doctoral students, as well as demonstrating the author's depth of study of the subject." D.Q.M. Fay, Computing Reviews

• Introduction; 1. Two-dimensional chip design; 2. Three-dimensional chip technology; 3. Three-dimensional circuit topology; 4. Three-dimensional cell tesselation; 5. Three-dimensional abutment system; 6. Abutment system configuration; 7. Abutment system evaluation; Conclusions; Appendices; Index.