Optical Inspection of Microsystems, Second Edition

Wolfgang Osten earned an MSc/Diploma in physics at Friedrich Schiller University Jena in 1979. From 1979 to 1984 he was a member of the Institute of Mechanics in Berlin, working in the field of experimental stress analysis and optical metrology. In 1983 he earned a PhD at the Martin Luther University Halle-Wittenberg for his thesis in the field of holographic interferometry. From 1984 to 1991 he was employed at the Central Institute of Cybernetics and Information Processes ZKI in Berlin, making investigations in digital image processing and computer vision. Between 1988 and 1991 he headed the Institute for Digital Image Processing at ZKI. From 1991 to 2002 he joined the Bremen Institute of Applied Beam Technology (BIAS) to establish and direct the Department of Optical 3D-Metrology. From September 2002 to October 2018 he was a full professor at the University of Stuttgart and director of the Institute for Applied Optics. From 2006 to 2010 he was the vice rector for research and technology transfer at Stuttgart University, and from 2015 to 2018 he was the vice chair of the university council. His research is focused on new concepts for industrial inspection and metrology by combining modern principles of optical metrology, sensor technology, and image processing. He directs special attention to the development of resolution-enhanced technologies for the investigation of micro- and nanostructures.

• 1. Image Processing and Computer Vision for MEMS Testing 2. Surface Features 3. A Metrological Characteristics Approach to Uncertainty in Surface Metrology 4. Image Correlation Techniques for Microsystems Inspection 5. Light Scattering Techniques for the Inspection of Microcomponents and Structures 6. Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM) 7. Optical Profiling Techniques for MEMS Measurement 8. Grid and Moiré Methods for Micromeasurements 9. Grating (Moiré) Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents 10. Interference Microscopy Techniques for Microsystem Characterization 11. Measuring MEMS in Motion by Laser Doppler Vibrometry 12. An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-of-Plane Deformations of MEMS and MOEMS 13. Optoelectronic Holography for Testing Electronic Packaging and MEMS 14. Digital Holography and Its Application in MEMS/MOEMS Inspection 15. Speckle Metrology for Microsystem Inspection 16. Spectroscopic Techniques for MEMS Inspection 17. Sensor Fusion in Multiscale Inspection Systems