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Yufu Zhang – författare

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  1. Sachin Sapatnekar, Ankur Srivastava, Yufu Zhang, Bing Shi, Avram Bar-Cohen - ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 4: THERMALLY-INFORMED DESIGN OF MICROELECTRONIC COMPONENTS, Inbunden. Tillgänglighet: Lägg i varukorg

    ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 4: THERMALLY-INFORMED DESIGN OF MICROELECTRONIC COMPONENTS

    Av Sachin Sapatnekar, Ankur Srivastava m. fl.

    Inbunden, 2014

    3543 kr

    Lägg i varukorg

    This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit and /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional …