Professor Wei Sha is Professor of Materials Science at The Queen’s University of Belfast, UK Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

"The author's use of modelling brings a new level of fundamental understanding to the field." --Materials World

• 1. Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions Part I: Electroless copper depositions2. Surface morphology evolution of electroless copper deposits3. Cross-section of electroless copper deposits and the void fraction4. Crystal structure and surface residual stress of electroless copper deposits5. The atomic model of the diamond pyramid structure in electroless copper deposits6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits7. Adhesion strength of electroless copper deposit to epoxy board8. Electrical resistivity of electroless copper deposit9. Applications of electroless copper depositsPart II: Electroless nickel–phosphorus (Ni–P) depositions10. Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content11. Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content12. Modelling the thermodynamics and kinetics of crystallisation of nickel–phosphorus (Ni–P) deposits13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits14. Hardness evolution of nickel–phosphorus (Ni–P) deposits with thermal processing15. Applications of electroless nickel–phosphorus (Ni–P) plating

Professor Wei Sha is Professor of Materials Science at The Queen’s University of Belfast, UK Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

"The author's use of modelling brings a new level of fundamental understanding to the field." --Materials World

• 1. Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions Part I: Electroless copper depositions2. Surface morphology evolution of electroless copper deposits3. Cross-section of electroless copper deposits and the void fraction4. Crystal structure and surface residual stress of electroless copper deposits5. The atomic model of the diamond pyramid structure in electroless copper deposits6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits7. Adhesion strength of electroless copper deposit to epoxy board8. Electrical resistivity of electroless copper deposit9. Applications of electroless copper depositsPart II: Electroless nickel–phosphorus (Ni–P) depositions10. Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content11. Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content12. Modelling the thermodynamics and kinetics of crystallisation of nickel–phosphorus (Ni–P) deposits13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits14. Hardness evolution of nickel–phosphorus (Ni–P) deposits with thermal processing15. Applications of electroless nickel–phosphorus (Ni–P) plating

Professor Wei Sha is Professor of Materials Science at The Queen’s University of Belfast, UK Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

"The author's use of modelling brings a new level of fundamental understanding to the field." --Materials World

• 1. Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions Part I: Electroless copper depositions2. Surface morphology evolution of electroless copper deposits3. Cross-section of electroless copper deposits and the void fraction4. Crystal structure and surface residual stress of electroless copper deposits5. The atomic model of the diamond pyramid structure in electroless copper deposits6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits7. Adhesion strength of electroless copper deposit to epoxy board8. Electrical resistivity of electroless copper deposit9. Applications of electroless copper depositsPart II: Electroless nickel–phosphorus (Ni–P) depositions10. Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content11. Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content12. Modelling the thermodynamics and kinetics of crystallisation of nickel–phosphorus (Ni–P) deposits13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits14. Hardness evolution of nickel–phosphorus (Ni–P) deposits with thermal processing15. Applications of electroless nickel–phosphorus (Ni–P) plating