This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 14th conference was held at the Hotel Boscolo, Nice, France (October 16-18, 2006). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt and Perth. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues.

This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 14th conference was held at the Hotel Boscolo, Nice, France (October 16-18, 2006). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt and Perth. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues.