ASHOK K. SHARMA is the author of Semiconductor Memories: Technology, Testing, and Reliability. He is currently working as a reliability engineering manager at NASA, Goddard Space Flight Center, Greenbelt, Maryland.

"...a valuable reference..." (Microelectronics Reliability, Vol. 43, 2003)

• Preface. Chapter 1: Introduction.Chapter 2: Random Access Memory Technologies.2.1 Introduction.2.2 Static Random Access Memories (SRAMs).2.3 Dynamic Random Access Memories (DRAMs).Chapter 3: Nonvolatile Memories.3.1 Introduction.3.2 Masked Read-Only Memories (ROMs).3.3 Programmable Read-Only Memories (PROMs).3.4 Erasable (UV)-Programmable Read-Only Memories (EPROMs).3.5 Electrically Erasable PROMs (EEPROMs).3.6 Flash Memories (EPROMs or EEPROMs).Chapter 4: Memory Fault Modeling and Testing.4.1 Introduction . . . .4.2 RAM Fault Modeling.4.3 RAM Electrical Testing.4.4 RAM Pseudorandom Testing.4.5 Megabit DRAM Testing.4.6 Nonvolatile Memory Modeling and Testing.4.7 IDDQ Fault Modeling and Testing.4.8 Application Specific Memory Testing.Chapter 5: Memory Design for Testability and Fault Tolerance.5.1 General Design for Testability Techniques.5.2 RAM Built-in Self-Test (BIST).5.3 Embedded Memory DFT and BIST Techniques.5.4 Advanced BIST and Built-in Self-Repair Architectures.5.5 DFT and BIST for ROMs.5.6 Memory Error-Detection and Correction Techniques.5.7 Memory Fault-Tolerance Designs.Chapter 6: Semiconductor Memory Reliability.6.1 General Reliability Issues.6.2 RAM Failure Modes and Mechanisms.6.3 Nonvolatile Memory Reliability.6.4 Reliability Modeling and Failure Rate Prediction.6.5 Design for Reliability.6.6 Reliability Test Structures.6.7 Reliability Screening and Qualification.Chapter 7: Semiconductor Memory Radiation Effects.7.1 Introduction.7.2 Radiation Effects.7.3 Radiation-Hardening Techniques.7.4 Radiation Hardness Assurance and Testing.Chapter 8: Advanced Memory Technologies.8.1 Introduction.8.2 Ferroelectric Random Access Memories (FRAMs).8.3 Gallium Arsenide (GaAs) FRAMs.8.4 Analog Memories.8.5 Magnetoresistive Random Access Memories (MRAMs).8.6 Experimental Memory Devices.Chapter 9: High-Density Memory Packaging Technologies.9.1 Introduction.9.2 Memory Hybrids and MCMs (2-D).9.3 Memory Stacks and MCMs (3-D).9.4 Memory MCM Testing and Reliability Issues.9.5 Memory Cards.9.6 High-Density Memory Packaging Future Directions.Index.