Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

This volume presents papers from the first international conference on the topic of thermal and mechanical simulation in micro-electronics, EuroSimE2000, in which the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics. These include: the state-of-the-art methodologies for thermal and mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. The main areas covered are: The impact of simulation on industry profitability; approaches to simulation; the state-of-the-art methodologies of simulation; and design optimization by simulation.