Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

Sandip Bhattacharya received his Ph.D. (Eng.) degree from the Indian Institute of Engineering Science and Technology (IIEST), India, in 2017. From October 2017 to December 2020, he worked as a postdoctoral researcher at the HiSIM research center, Hiroshima University, Japan. He is currently working as an Associate Professor and Head of the Department of Electronics and Communication Engineering at SR University, Warangal, Telangana, India. His current research interests are nano device and interconnect modeling. J. Ajayan received his B.Tech. degree in Electronics and Communication Engineering from Kerala University in 2009, and M.Tech. and Ph.D. degrees in Electronics and Communication Engineering from Karunya University, Coimbatore, India, in 2012 and 2017, respectively. He is an Associate Professor in the Department of Electronics and Communication Engineering at SR University, Telangana, India. He has published more than 100 research articles in various journals and international conferences. He has published two books, more than ten book chapters, and has two patents. He is a reviewer of more than 30 journals for various publishers. He was the Guest Editor for several of the special issues. His areas of interest are microelectronics, semiconductor devices, nanotechnology, RF integrated circuits, and photovoltaics. Fernando Avila Herrera has worked in the field of academic and semiconductor industry. He has involved with the modeling and characterization of semiconductor devices, especially MOSFETs. Further, he has experience in device reliability modeling, model parameter extraction, Verilog-A, TCAD, and EDA tools. He also has experience in HiSIM family models for parameter extraction and physics modeling and FPGA programming. He has collaborated with different groups for developing compact models.

• 1 Nanomaterials for Next-Generation Interconnects2 Interconnect Modeling Using Graphene Nanoribbon (GNR)3 Introduction to Nanoscale Interconnect Materials4 Analysis of Simultaneous Switching Noise and IR Drop5 Temperature-Dependent RF Performance Analysis of GNR-Based Nano-Interconnect Systems6 Electro-Thermal Modeling of CNT and GNR Interconnect for Nano-Electronic Circuits7 Hybrid Cu-Carbon as Interconnect Materials and Their Interconnect Models8 Hybrid Cu-CNT Composite as Interconnect Materials and Their Equivalent Models9 Relative Stability Analysis of the GNR and Cu Interconnect10 Transmission Line-Based Modeling of CNT and GNR Interconnects Using Numerical Methods