J. Paul Davim works for KINNSYS, Brussels, Belgium.Mark Jackson works for Jackson Ashcroft Associates, London, UK.

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• Preface ixChapter 1. Nanoscale Cutting 1Rüdiger RENTSCH1.1. Introduction 11.2. Basic elements of molecular dynamics modeling 31.2.1. Material representation and microstructure 31.2.2. Atomic interaction 41.2.3. System dynamics and numerical description 71.2.4. Boundary conditions 81.3. Design and requirements for state-of-the-art MD cutting process simulations 101.4. Capabilities of MD for nanoscale material removal process analysis 121.4.1. Analysis of microstructure and deformation 121.4.2. Obtaining cutting forces, stress and temperature 151.5. Advances and recent developments in material removal process simulation 181.5.1. Complete 3D surface machining simulation 181.5.2. Consideration of fluids in MD cutting simulation 201.6. Summary and outlook 231.7. References 24Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces 27Xiaoping LI2.1. Introduction 272.2. The mechanism of ductile mode cutting of brittle materials 292.2.1. Transition of chip formation mode from ductile to brittle 292.2.2. MD modeling and simulation of nanoscale ductile mode cutting of silicon 322.2.3. The mechanism of ductile mode chip formation in cutting of silicon 322.3. The chip formation in cutting of brittle materials 352.3.1. Material deformation and crack initiation in the chip formation zone 352.3.2. Stress conditions in the chip formation zone in relation to ductile-brittle mode of chip formation 362.4. Machined surfaces in relation to chip formation mode 382.5. References 40Chapter 3. Diamond Tools in Micromachining 45Waqar AHMED, Mark J. JACKSON and Michael D. WHITFIELD3.1. Introduction 453.2. Diamond technology 453.2.1. Hot Filament CVD (HFCVD) 463.3. Preparation of substrate 483.3.1. Selection of substrate material 483.3.2. Pre-treatment of substrate 493.4. Modified HFCVD process 513.4.1. Modification of filament assembly 513.4.2. Process conditions 523.5. Nucleation and diamond growth 533.5.1. Nucleation 543.5.2. Bias-enhanced nucleation (BEN) 553.5.3. Influence of temperature 563.6. Deposition on complex substrates 583.6.1. Diamond deposition on metallic (molybdenum) wire 583.6.2. Deposition on WC-Co microtools 583.6.3. Diamond deposition on tungsten carbide (WC-Co) microtool 593.7. Diamond micromachining 623.7.1. Performance of diamond-coated microtool 663.8. Conclusions 673.9. References 67Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling 71Wit GRZESIK4.1. Introduction 714.1.1. Definitions and technological possibilities 714.1.2. Main applications of micromachining 724.2. Microturning 744.2.1. Characteristic features and applications 744.2.2. Microturning tools and tooling systems 754.2.3. Machine tools for microturning 774.3. Microdrilling 794.3.1. Characteristic features and applications 794.3.2. Microdrills and tooling systems 804.3.3. Machine tools for microdrilling 834.4. Micromilling 854.4.1. Characteristic features and applications 854.4.2. Micromills and tooling systems 874.4.3. Machine tools for micromilling 894.5. Product quality in micromachining 924.5.1. Quality challenges in micromachining 924.5.2. Burr formation in micromachining operations 924.5.3. Surface quality inspection of micromachining products 964.6. References 98Chapter 5. Microgrinding and Ultra-precision Processes 101Mark J. JACKSON and Michael D. WHITFIELD5.1. Introduction 1015.2. Micro and nanogrinding 1045.2.1. Nanogrinding apparatus. 1055.2.2. Nanogrinding procedures 1055.3. Nanogrinding tools 1065.3.1. Dissolution modeling 1095.3.2. Preparation of nanogrinding wheels 1105.3.3. Bonding systems 1125.3.4. Vitrified bonding systems 1135.4. Conclusions 1215.5. References 122Chapter 6. Non-Conventional Processes: Laser Micromachining 125Grant M. ROBINSON and Mark J. JACKSON6.1. Introduction 1256.2. Fundamentals of lasers 1266.2.1. Stimulated emission 1266.2.2. Types of lasers 1276.2.3. Laser optics 1286.2.4. Beam quality 1296.2.5. Laser-material interactions 1316.3. Laser microfabrication 1336.3.1. Nanosecond pulse microfabrication 1336.3.2.Shielding gas 1356.3.3. Nozzle designs for laser micromachining 1366.3.4. Stages of surface melting 1386.3.5. Effects of nanosecond pulsed microfabrication 1386.3.6. Picosecond pulse microfabrication 1436.3.7. Femtosecond pulse microfabrication 1466.3.8. Effects of femtosecond laser machining 1506.4. Laser nanofabrication 1516.5. Conclusions 1546.6. References 154Chapter 7.Evaluation of Subsurface Damage in Nano and Micromachining 157Jianmei ZHANG, Jiangang SUN and Zhijian PEI7.1. Introduction 1577.2. Destructive evaluation technologies 1587.2.1. Cross-sectional microscopy 1587.2.2. Preferential etching 1597.2.3. Angle lapping/angle polishing 1597.3. Non-destructive evaluation technologies 1607.3.1. X-ray diffraction 1607.3.2. Micro-Raman spectroscopy 1647.3.3. Laser scattering 1677.4. Acknowledgements 1727.5. References 172Chapter 8. Applications of Nano and Micromachining in Industry 175Jiwang YAN8.1. Introduction 1758.2. Typical machining methods 1768.2.1. Diamond turning 1768.2.2. Shaper/planner machining 1788.3. Applications in optical manufacturing 1798.3.1. Aspheric lens 1798.3.2. Fresnel lens 1868.3.3. Microstructured components 1938.4. Semiconductor and electronics related applications 2008.4.1. Semiconductor wafer production 2008.4.2. LSI substrate planarization 2028.5. Summary 2038.6. Acknowledgements 2048.7. References 204List of Authors 209Index 211