'...this book is an extremely valuable collection on the crucial issues in numerical modeling of VLSI fabrication processes and devices, which will be useful to a large number of readers with diverse backgrounds.' American Scientist, 73 (1983)

• Diffusion in Silicon.- Thermal Oxidation: Kinetics, Charges, Physical Models, and Interaction with Other Processes in VLSI Devices.- The Use of Chlorinated Oxides and Intrinsic Gettering Techniques for VLSI Processing.- Ion Implantation.- Beam Annealing of Ion Implanted Silicon.- Materials Characterization.- Modeling of Polycrystalline Silicon Structures for Integrated Circuit Fabrication Processes.- Two-Dimensional Process Simulation — Supra.- Numerical Simulation of Impurity Redistribution Near Mask Edges.- Optical and Deep UV Lithography.- Wafer Topography Simulation.- Analyses of Nonplanar Devices.- Two Dimensional MOS-Transistor Modeling.- Fielday — Finite Element Device Analyses.

'...this book is an extremely valuable collection on the crucial issues in numerical modeling of VLSI fabrication processes and devices, which will be useful to a large number of readers with diverse backgrounds.' American Scientist, 73 (1983)

• Diffusion in Silicon.- Thermal Oxidation: Kinetics, Charges, Physical Models, and Interaction with Other Processes in VLSI Devices.- The Use of Chlorinated Oxides and Intrinsic Gettering Techniques for VLSI Processing.- Ion Implantation.- Beam Annealing of Ion Implanted Silicon.- Materials Characterization.- Modeling of Polycrystalline Silicon Structures for Integrated Circuit Fabrication Processes.- Two-Dimensional Process Simulation — Supra.- Numerical Simulation of Impurity Redistribution Near Mask Edges.- Optical and Deep UV Lithography.- Wafer Topography Simulation.- Analyses of Nonplanar Devices.- Two Dimensional MOS-Transistor Modeling.- Fielday — Finite Element Device Analyses.

'...this book is an extremely valuable collection on the crucial issues in numerical modeling of VLSI fabrication processes and devices, which will be useful to a large number of readers with diverse backgrounds.' American Scientist, 73 (1983)

• Diffusion in Silicon.- Thermal Oxidation: Kinetics, Charges, Physical Models, and Interaction with Other Processes in VLSI Devices.- The Use of Chlorinated Oxides and Intrinsic Gettering Techniques for VLSI Processing.- Ion Implantation.- Beam Annealing of Ion Implanted Silicon.- Materials Characterization.- Modeling of Polycrystalline Silicon Structures for Integrated Circuit Fabrication Processes.- Two-Dimensional Process Simulation — Supra.- Numerical Simulation of Impurity Redistribution Near Mask Edges.- Optical and Deep UV Lithography.- Wafer Topography Simulation.- Analyses of Nonplanar Devices.- Two Dimensional MOS-Transistor Modeling.- Fielday — Finite Element Device Analyses.