Simon Deleonibus was chief scientist with CEA-Leti, a technology research unit of French Alternative Energies and Atomic Energy Commission, where his research focused on architectures of micro- and nanoelectronic devices. He retired January 2016. Before joining CEA-Leti in 1986, he was with Thomson Semiconductors (1981–1986), where he developed advanced microelectronic devices and products. He is a visiting professor at the Tokyo Institute of Technology, Japan, since 2014; National Chiao Tung University, Taiwan, since 2015; and Chinese Academy of Sciences, China, since 2016. He is a distinguished CEA research director (2002), IEEE distinguished lecturer (2004), fellow of the IEEE (2006), and fellow of the Electrochemical Society (2015). Dr. Deleonibus is a recipient of the titles Chevalier de l’Ordre National du Mérite (2004), Chevalier de l’Ordre des Palmes Académiques (2011), and Grand Prix de l’Académie des Technologies (2005).

"This book rightly acknowledges that more Moore, more than Moore, and beyond Moore are temporary, if not artificial, partitions. The three can neither displace nor substitute one another. Denser integration, new devices, and additional materials complement each other and emerge when the technology is ready and economics is right."—Prof. Chenming Hu, University of California at Berkeley, USA"New heterogeneous integration technologies based on all aspects of materials, devices, and nanosystems are indispensable in the era of sustainable and energy-efficient nanoelectronics and nanosystems. This book provides useful information and insights into the prospects of future technological revolution." —Prof. Mitsumasa Koyanagi, Tohoku University, Japan"Improving semiconductor device performance by miniaturization technology is approaching its end. New materials, new architectures, and new functional applications are necessary for future breakthroughs. This book presents important topics, covered by leading experts in the field of nanoelectronics and nanosystems, that are quite useful to catch up on the current state of the art and to seek for future prospects." —Prof. Shunri Oda, Tokyo Institute of Technology, Japan"Not only engineering professionals but also researchers, especially students beginning research, may save sufficient time learning from noted experts in the field with a quick overview of 2D to 3D nanodevices and nanosystems." —Prof. Steve Chung, National Chiao Tung University, Taiwan

• Part 1: From Nanoelectronics to Diversified Nanosystems 1. The Era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems 2. From 2D to 3D Nonvolatile Memories 3. Three-dimensional (3D) Vertical RRAM 4. SOI Technologies for RF and Millimeter Wave Applications Part 2: Nanofunctions for Augmented Nanosystems 5. Graphene nanoelectromechanical (NEM) switch: ultimate downscaled NEM actuators to single molecule and zeptogram mass sensors 6. Self-powered 3D Nanosensor Systems for Mechanical Interfacing Applications 7.Miniaturization and packaging of implantable biomedical silicon devices

Simon Deleonibus was chief scientist with CEA-Leti, a technology research unit of French Alternative Energies and Atomic Energy Commission, where his research focused on architectures of micro- and nanoelectronic devices. He retired January 2016. Before joining CEA-Leti in 1986, he was with Thomson Semiconductors (1981–1986), where he developed advanced microelectronic devices and products. He is a visiting professor at the Tokyo Institute of Technology, Japan, since 2014; National Chiao Tung University, Taiwan, since 2015; and Chinese Academy of Sciences, China, since 2016. He is a distinguished CEA research director (2002), IEEE distinguished lecturer (2004), fellow of the IEEE (2006), and fellow of the Electrochemical Society (2015). Dr. Deleonibus is a recipient of the titles Chevalier de l’Ordre National du Mérite (2004), Chevalier de l’Ordre des Palmes Académiques (2011), and Grand Prix de l’Académie des Technologies (2005).

"This book rightly acknowledges that more Moore, more than Moore, and beyond Moore are temporary, if not artificial, partitions. The three can neither displace nor substitute one another. Denser integration, new devices, and additional materials complement each other and emerge when the technology is ready and economics is right."—Prof. Chenming Hu, University of California at Berkeley, USA"New heterogeneous integration technologies based on all aspects of materials, devices, and nanosystems are indispensable in the era of sustainable and energy-efficient nanoelectronics and nanosystems. This book provides useful information and insights into the prospects of future technological revolution." —Prof. Mitsumasa Koyanagi, Tohoku University, Japan"Improving semiconductor device performance by miniaturization technology is approaching its end. New materials, new architectures, and new functional applications are necessary for future breakthroughs. This book presents important topics, covered by leading experts in the field of nanoelectronics and nanosystems, that are quite useful to catch up on the current state of the art and to seek for future prospects." —Prof. Shunri Oda, Tokyo Institute of Technology, Japan"Not only engineering professionals but also researchers, especially students beginning research, may save sufficient time learning from noted experts in the field with a quick overview of 2D to 3D nanodevices and nanosystems." —Prof. Steve Chung, National Chiao Tung University, Taiwan

• Part 1: From Nanoelectronics to Diversified Nanosystems 1. The Era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems 2. From 2D to 3D Nonvolatile Memories 3. Three-dimensional (3D) Vertical RRAM 4. SOI Technologies for RF and Millimeter Wave Applications Part 2: Nanofunctions for Augmented Nanosystems 5. Graphene nanoelectromechanical (NEM) switch: ultimate downscaled NEM actuators to single molecule and zeptogram mass sensors 6. Self-powered 3D Nanosensor Systems for Mechanical Interfacing Applications 7.Miniaturization and packaging of implantable biomedical silicon devices

Simon Deleonibus was chief scientist with CEA-Leti, a technology research unit of French Alternative Energies and Atomic Energy Commission, where his research focused on architectures of micro- and nanoelectronic devices. He retired January 2016. Before joining CEA-Leti in 1986, he was with Thomson Semiconductors (1981–1986), where he developed advanced microelectronic devices and products. He is a visiting professor at the Tokyo Institute of Technology, Japan, since 2014; National Chiao Tung University, Taiwan, since 2015; and Chinese Academy of Sciences, China, since 2016. He is a distinguished CEA research director (2002), IEEE distinguished lecturer (2004), fellow of the IEEE (2006), and fellow of the Electrochemical Society (2015). Dr. Deleonibus is a recipient of the titles Chevalier de l’Ordre National du Mérite (2004), Chevalier de l’Ordre des Palmes Académiques (2011), and Grand Prix de l’Académie des Technologies (2005).

"This book rightly acknowledges that more Moore, more than Moore, and beyond Moore are temporary, if not artificial, partitions. The three can neither displace nor substitute one another. Denser integration, new devices, and additional materials complement each other and emerge when the technology is ready and economics is right."—Prof. Chenming Hu, University of California at Berkeley, USA"New heterogeneous integration technologies based on all aspects of materials, devices, and nanosystems are indispensable in the era of sustainable and energy-efficient nanoelectronics and nanosystems. This book provides useful information and insights into the prospects of future technological revolution." —Prof. Mitsumasa Koyanagi, Tohoku University, Japan"Improving semiconductor device performance by miniaturization technology is approaching its end. New materials, new architectures, and new functional applications are necessary for future breakthroughs. This book presents important topics, covered by leading experts in the field of nanoelectronics and nanosystems, that are quite useful to catch up on the current state of the art and to seek for future prospects." —Prof. Shunri Oda, Tokyo Institute of Technology, Japan"Not only engineering professionals but also researchers, especially students beginning research, may save sufficient time learning from noted experts in the field with a quick overview of 2D to 3D nanodevices and nanosystems." —Prof. Steve Chung, National Chiao Tung University, Taiwan

• Part 1: From Nanoelectronics to Diversified Nanosystems 1. The Era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems 2. From 2D to 3D Nonvolatile Memories 3. Three-dimensional (3D) Vertical RRAM 4. SOI Technologies for RF and Millimeter Wave Applications Part 2: Nanofunctions for Augmented Nanosystems 5. Graphene nanoelectromechanical (NEM) switch: ultimate downscaled NEM actuators to single molecule and zeptogram mass sensors 6. Self-powered 3D Nanosensor Systems for Mechanical Interfacing Applications 7.Miniaturization and packaging of implantable biomedical silicon devices