Antonio Rubio - Böcker

Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high-performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge of achieving compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is therefore mandatory for every IC designer. This is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results.The aim is to provide an understanding of the reasons for these particular mechanisms of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction.

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. Abnormal status of this variable, both too high and too low, is sign of abnormal behaviour in electronic systems. In this text, the authors present the feasibility to consider temperature as an observable for testing purposes. In the book, the basis of heat propagation, heat conducting mechanisms and temperature sensitivity of semiconductors are focused with a full coverage of the state-of-the art. We have usually the idea that all the heating processes are slow - this that is true in the macroscopic world is not in the case of integrated circuits where the reduced size and amount of material and the really high conductivity of substrates make the thermal testing a promising technique. CMOS and BICMOS temperature sensors for built-in thermal testing are presented in the book. The application of temperature as testing magnitude for both on-line and off-line, analog or digital, on-chip or off-chip are considered.The temperature sensing has an inherent directional capability that can be used as an element for localizing failures, so the technique has interesting diagnosis capabilities as well.

Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results.The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.

Integrated circuits (IC's) have undergone a significant evolution in terms of complexity and performance as a result 'of the substantial advances made in manufacturing technology. Circuits, in their various mixed formats, can be made up tens or even hundreds of millions of devices. They work at extremely low voltages and switch at very high frequencies. Testing of circuits has become an essential process in IC manufacturing, in the effort to ensure that the manufactured components have the appropriate levels of quality. Along with the ongoing trend towards more advanced technology and circuit features, major testing challenges are continuously emerging. The use of ambivalent procedures to test the analogue and digital sections of such complex circuits without interfering in their nominal operation is clearly a critical part of today's technological ipdustries. Chapter 1 presents the general purposes and basic concepts rel~ted With' the"testing of integrated circuits, discussing the various strategies and their limitations. Readers who are already familiar with the field may opt to skip this chapter. This book offers a multidisciplinary focus on thermal testing. This is a testing method which is not only suitable for use in combination with other existing techniques, but is also backed by a wealth of knowledge and offers exciting opportunities in the form of as yet unexplored areas of research and innovation for industrial applications.

En uppfriskande och färgstark dikt-sång som introducerar frukter genom melodisk läsning och ger näring åt både kropp och sinne. De la cuna a la luna är en serie poetiska pictogram för barn 0–3 år, skapad av Antonio Rubio och illustrerad av Óscar Villán, som förenar enkelhet, rytm och bilder för att stödja tidig läs- och lyssnarutveckling.