Bin He – författare

About the Series:

Bioelectric Engineering presents state-of-the-art discussions on modern biomedical engineering with respect to applications of electrical engineering and information technology in biomedicine. This focus affirms Springer’s commitment to publishing important reviews of the broadest interest to biomedical engineers, bioengineers, and their colleagues in affiliated disciplines. Recent volumes have covered modeling and imaging of bioelectric activity, neural engineering, biosignal processing, bionanotechnology, among other topics.

Key Features of this Volume:

Neural Engineering (Bioelectric Engineering Volume 3) contains reviews and discussions of contemporary and relevant topics by leading investigators in the field. It is intended to serve as a textbook at the graduate and advanced undergraduate level in a bioengineering curriculum. The topics include:

– Neural Prostheses

– Neural Interfacing

– Neural Robotics

– Functional Neural Stimulation

– Neural Imaging

– Neural Computation

– Neural Networks

– Neural System Identification and Prediction

– Retinal Neuroengineering

This principles and applications approach to neural engineering is essential reading for all academics, biomedical engineers, neuroscientists, neurophysiologists, and industry professionals wishing to take advantage of the latest and greatest in this emerging field.

About the Editor:

Bin He, PhD., IEEE Fellow, is a leading figure in the field of bioelectric engineering. An internationally recognized scientist with numerous publications, Dr. He has served as the President of the International Society of Bioelectromagnetism and as an Associate or Guest Editor for nine international journals in the field of biomedical engineering. Dr. He is currently Professor of Biomedical Engineering at the University of Minnesota.

This third edition overviews the essential contemporary topics of neuroengineering, from basic principles to the state-of-the-art, and is written by leading scholars in the field. The book covers neural bioelectrical measurements and sensors, EEG signal processing, brain-computer interfaces, implantable and transcranial neuromodulation, peripheral neural interfacing, neuroimaging, neural modelling, neural circuits and system identification, retinal bioengineering and prosthetics, and neural tissue engineering. Each chapter is followed by homework questions intended for classroom use.

Advance Praise for Neural Engineering, 3rd Edition:

“A comprehensive and timely contribution tothe ever growing field of neural engineering.  Bin He’s edited volume provides chapters that cover both the fundamentals  and  state-of-the-art developments by the world’s leading neural engineers."

Dr. Paul Sajda, Department of Biomedical Engineering, Electrical Engineering and Radiology, Columbia University

“Neural Engineering, edited by Prof. He, is an outstanding book for students entering into this fast evolving field as well as experienced researchers. Its didactic and comprehensive style, with each chapter authored by leading scientific authorities, provides the ultimate reference for the field.”

"Neural Engineering has come of age.  Major advances have made possible prosthesis for the blind,

mind control for quadraplegics and direct intervention to control seizures in epilepsy patients. 

Neural Engineering brings together reviews by leading researchers in this flourishing field.

Dr. Terrence Sejnowski, Salk Institute for Biolgical Studies and UC San Diego

This book summarizes the advanced manufacturing technology of original innovations in hot stamping of lightweight car body. A detailed description of the technical system and basic knowledge of sheet metal forming is given, which helps readers quickly understand the relevant knowledge in the field. Emphasis has been placed on the independently developed hot stamping process and equipment, which help describe the theoretical and experimental research on key problems involving stress field, thermal field and phase transformation field in hot stamping process. Also, a description of the formability at elevated temperature and the numerical simulation algorithms for high strength steel hot stamping is given in combination with the experiments. Finally, the book presents some application cases of hot stamping technology such as the lightweight car body design using hot stamping components and gradient hardness components, and the cooling design of the stamping tool.

 This bookis intended for researchers, engineers and graduate students in vehicle engineering, mechanical engineering, especially in the field of advanced manufacturing technology. The book also provides a useful reference for other new technology related temperature and phase transformation, such as aluminum-magnesium alloy hot stamping.