This handbook is a world-class reference volume on the processes, industry requirements, and emerging application areas of printed electronics. Containing contributions from experts in academia and industry, it provides a balanced presentation of the field and is appropriate for a wide audience, from students, to researchers and industrial product designers. It is organized into 3 sections; the first focuses on materials used in printed electronics devices. Chapters cover the requirements for components such as active materials, interconnects, passives, substrates and encapsulation, current state-of-the-art, and possible future developments. Fundamental performance requirements are also critically assessed and compared with properties of materials currently available.The second section covers all aspects of available and foreseeable process technology and critically reviews the suitability of methods and materials for production processes. Topics that are addressed include fabrication, dispersion and inks, film formation and drying processes, sheet-based and roll-to-roll printing techniques, encapsulation processes, microcontact printing, and nano-imprint lithography.The last section presents an overview of device-level printed electronics and technologies that have reached a level of maturation that allows for design and fabrication of integrated modules and systems. The current research and industrial developments are reviewed for printed lighting and displays, printed photovoltaics, organic/inorganic/hybrid components for printed electronics, printed transistors and logic structures, and printed energy storage devices.

This handbook is a world-class reference volume on the processes, industry requirements, and emerging application areas of printed electronics. Containing contributions from experts in academia and industry, it provides a balanced presentation of the field and is appropriate for a wide audience, from students, to researchers and industrial product designers. It is organized into 3 sections; the first focuses on materials used in printed electronics devices. Chapters cover the requirements for components such as active materials, interconnects, passives, substrates and encapsulation, current state-of-the-art, and possible future developments. Fundamental performance requirements are also critically assessed and compared with properties of materials currently available.The second section covers all aspects of available and foreseeable process technology and critically reviews the suitability of methods and materials for production processes. Topics that are addressed include fabrication, dispersion and inks, film formation and drying processes, sheet-based and roll-to-roll printing techniques, encapsulation processes, microcontact printing, and nano-imprint lithography.The last section presents an overview of device-level printed electronics and technologies that have reached a level of maturation that allows for design and fabrication of integrated modules and systems. The current research and industrial developments are reviewed for printed lighting and displays, printed photovoltaics, organic/inorganic/hybrid components for printed electronics, printed transistors and logic structures, and printed energy storage devices.