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Dae Young Jung – författare

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1 produkter

  1. BAR-COHEN AVRAM, Pengli Zhu, Gang Li, C P Wong, Dae Young Jung, Stephen R Cain, William (Bill) T Chen, Bahgat G Sammakia, Muhannad S Bakir, Suresh K Sitaraman, Kuan-Neng Chen, Chuan Seng Tan - ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET), Inbunden. Tillgänglighet: Lägg i varukorg

    ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

    Av BAR-COHEN AVRAM, Pengli Zhu m. fl.

    Inbunden, 2019

    22007 kr

    Lägg i varukorg

    Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of …