E. Todd Ryan – författare
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.
Av Qinghuang Lin, E. Todd Ryan m. fl.
Häftad, 2014
471 kr
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In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid …