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12 produkter
12 produkter
2 630 kr
Skickas inom 7-10 vardagar
This book provides readers with an incisive look at cutting-edge peridynamic modeling methods, numerical techniques, their applications, and potential future directions for the field. It starts with an introductory chapter authored by Stewart Silling, who originally developed peridynamics. It then looks at new concepts in the field, with chapters covering dual-horizon peridynamics, peridynamics for axisymmetric analysis, beam and plate models in peridynamics, coupled peridynamics and XFEM, peridynamics for dynamic fracture modeling, and more. From there, it segues into coverage of cutting-edge applications of peridynamics, exploring its biological applications, modeling at the nanoscale, peridynamics for composites delamination and damage in ceramics, and more, concluding with a chapter on the application of artificial intelligence and machine learning in peridynamics. Covers modeling methods, numerical techniques, applications, and future directions for the field Discusses techniques such as dual-horizon peridynamics, damage modeling using the phase-field approach, and contact analysis of rigid and deformable bodies with refined non-ordinary state-based peridynamics Looks at a range of different peridynamic applications such as ice modeling, fiber-reinforced composite modeling, modeling at nanoscale, and more
1 798 kr
Skickas inom 10-15 vardagar
Fatigue reliability of solder joints is an important issue in the electronics industry. There have been several attempts to accurately predict the expected service life of an electronic component. One method has emerged as the most widely used for a multitude of package configurations. However, this method requires the knowledge of finite element modelling and simulation with ANSY TM, a commercially available finite element program. Furthermore, a three-dimensional finite element modelling of any electronic package remains a formidable task even if the analyst has extensive knowledge of ANSYS TM. This text describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS TM that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion.
Del 719 - Springer International Series in Engineering and Computer Science
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Häftad, Engelska, 2012
1 798 kr
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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
1 061 kr
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This book presents the peridynamic theory, which provides the capability for improved modeling of progressive failure in materials and structures, and paves the way for addressing multi-physics and multi-scale problems.
1 377 kr
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The Finite Element Method and Applications in Engineering Using ANSYS(R)
955 kr
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This textbook offers theoretical and practical knowledge of the finite element method. The book equips readers with the skills required to analyze engineering problems using ANSYS®, a commercially available FEA program. Revised and updated, this new edition presents the most current ANSYS® commands and ANSYS® screen shots, as well as modeling steps for each example problem. This self-contained, introductory text minimizes the need for additional reference material by covering both the fundamental topics in finite element methods and advanced topics concerning modeling and analysis. It focuses on the use of ANSYS® through both the Graphics User Interface (GUI) and the ANSYS® Parametric Design Language (APDL). Extensive examples from a range of engineering disciplines are presented in a straightforward, step-by-step fashion. Key topics include: • An introduction to FEM • Fundamentals and analysis capabilities of ANSYS® • Fundamentals of discretization and approximationfunctions • Modeling techniques and mesh generation in ANSYS®• Weighted residuals and minimum potential energy • Development of macro files • Linear structural analysis • Heat transfer and moisture diffusion • Nonlinear structural problems • Advanced subjects such as submodeling, substructuring, interaction with external files, and modification of ANSYS®-GUI Electronic supplementary material for using ANSYS® can be found at http://link.springer.com/book/10.1007/978-1-4899-7550-8. This convenient online feature, which includes color figures, screen shots and input files for sample problems, allows for regeneration on the reader’s own computer. Students, researchers, and practitioners alike will find this an essential guide to predicting and simulating the physical behavior of complex engineering systems."
692 kr
Skickas inom 10-15 vardagar
This book presents the peridynamic theory, which provides the capability for improved modeling of progressive failure in materials and structures, and paves the way for addressing multi-physics and multi-scale problems.
955 kr
Skickas inom 10-15 vardagar
PD also serves as a natural filter to smooth noisy data and to recover missing data. This book starts with an overview of the PD concept, the derivation of the PD differential operator, its numerical implementation for the spatial and temporal derivatives, and the description of sources of error.
2 325 kr
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This book presents recent improvements in peridynamic modeling of structures.
2 325 kr
Skickas inom 10-15 vardagar
This book presents recent improvements in peridynamic modeling of structures.
903 kr
Skickas inom 10-15 vardagar
This book introduces a unified implementation of bond- and state-based peridynamic theory (PD) within a commercial finite element framework, Ansys, utilizing its native elements. It details the implementation of the PD theory and its integration with traditional finite elements. The primary objective is to equip students, researchers, and practicing engineers with both theoretical and practical knowledge of the PD theory, along with the skills necessary for analyzing engineering problems using Ansys.The book demonstrates that, unlike the conventional finite element method (FEM), the PD theory is highly suitable for progressive failure analysis, the multi-scale analysis of materials involving fracture and failure, and multi-physics analysis, including electromigration, corrosion, and electrodeposition. Additionally, it provides a step-by-step illustration of the specific procedures in the pre-processing, solution, and post-processing phases of the analysis through the Graphical User Interface (GUI) for various applications.The book is designed to be introductory and self-contained, minimizing the need for additional reference material.
1 061 kr
Skickas inom 10-15 vardagar
This book introduces a unified implementation of bond- and state-based peridynamic theory (PD) within a commercial finite element framework, Ansys, utilizing its native elements. It details the implementation of the PD theory and its integration with traditional finite elements. The primary objective is to equip students, researchers, and practicing engineers with both theoretical and practical knowledge of the PD theory, along with the skills necessary for analyzing engineering problems using Ansys.The book demonstrates that, unlike the conventional finite element method (FEM), the PD theory is highly suitable for progressive failure analysis, the multi-scale analysis of materials involving fracture and failure, and multi-physics analysis, including electromigration, corrosion, and electrodeposition. Additionally, it provides a step-by-step illustration of the specific procedures in the pre-processing, solution, and post-processing phases of the analysis through the Graphical User Interface (GUI) for various applications.The book is designed to be introductory and self-contained, minimizing the need for additional reference material.