J. H. Westbrook – författare

This third volume continues to set the standard in the field, as originally defined by the best-selling two-volume set Intermetallic Compounds: Principles and Practice. With contributions from 72 authors from 14 different countries, this book introduces a broad range of new topics including: new intermetallic families, new means of assessment of bonding and stability, new properties and phenomena, new applications, new practical processes and new research techniques. Stand-alone chapters set out in a manner that is meaningful to non-specialists, progressing to include knowledge useful to expertsNew, fully revised, and updated chapters on areas of intense research activity or great importanceProviding definitions of intermetallic families, intended to assist all readersWritten for clarity, consistency and thoroughnessFull and up-to-date referencing to the literatur Critical assessments of the state of the subjectAcronym list consolidating new entries with those compiled for the two earlier volumesAs with Volumes 1 and 2, this is an invaluable aid to both scientists and engineers. Core reading for those who are starting research on intermetallics, and for those who wish to exploit the unique properties of intermetallics in practical applications.

An intermetallic compound is one consisting of two or more metallic elements present in definite proportions in alloy. They are used in a wide range of industries such as semiconductors and the aerospace industry. Thousands of tons of the nickel aluminum alloy are used worldwide every year.

These two volumes provide a comprehensive source for scientists and engineers interested in intermetallics. Experts from 15 countries cover fundamental theory, experimental aspects, practical applications (both current and potential) and critical assessment. Volume one is devoted to the science of intermetallic compounds - their formation, structure, bonding and properties. Volume two deals with the applications of intermetallic compounds, from initial uses, present commercial and future applications.