James E. Morris - Böcker

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal–oxide–semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe.The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include:Nanoscale advances in current MOSFET/CMOS technologyNano capacitors for applications such as electronics packaging and humidity sensorsSingle electron transistors and other electron tunneling devicesQuantum cellular automata and nanomagnetic logicMemristors as switching devices and for memoryGraphene preparation, properties, and devicesCarbon nanotubes (CNTs), both single CNT and random networkOther CNT applications such as terahertz, sensors, interconnects, and capacitorsNano system architectures for reliabilityNanowire device fabrication and applicationsNanowire transistorsNanodevices for spintronicsThe book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.

Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled. The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires.Featuring contributions by experts from academia and industry around the world, this book presents cutting-edge nanofabrication research in a wide range of areas. Topics include:CNT electrodynamics and signal propagation modelsElectronic structure calculations of a graphene–hexagonal boron nitride interface to aid the understanding of experimental devices based on these heterostructuresHow a laser field would modify the electronic structure and transport response of graphene, to generate bandgapsThe fabrication of transparent CNT electrodes for organic light-emitting diodesDirect graphene growth on dielectric substrates, and potential applications in electronic and spintronic devicesCNTs as a promising candidate for next-generation interconnect conductorsCMOS–CNT integration approaches, including the promising localized heating CNT synthesis methodCNTs in electrochemical and optical biosensorsThe synthesis of diamondoids by pulsed laser ablation plasmas generated in supercritical fluids, and possible applicationsThe use of DNA nanostructures in lithographyCMOS-compatible silicon nanowire biosensorsThe use of titanium oxide-B nanowires to detect explosive vaporsThe properties of protective layers on silver nanoparticles for ink-jet printingNanostructured thin-film production using microreactorsA one-stop reference for professionals, researchers, and graduate students working in nanofabrication, this book will also be useful for investors who want an overview of the current nanofabrication landscape.

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.

Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled. The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires.Featuring contributions by experts from academia and industry around the world, this book presents cutting-edge nanofabrication research in a wide range of areas. Topics include:CNT electrodynamics and signal propagation modelsElectronic structure calculations of a graphene–hexagonal boron nitride interface to aid the understanding of experimental devices based on these heterostructuresHow a laser field would modify the electronic structure and transport response of graphene, to generate bandgapsThe fabrication of transparent CNT electrodes for organic light-emitting diodesDirect graphene growth on dielectric substrates, and potential applications in electronic and spintronic devicesCNTs as a promising candidate for next-generation interconnect conductorsCMOS–CNT integration approaches, including the promising localized heating CNT synthesis methodCNTs in electrochemical and optical biosensorsThe synthesis of diamondoids by pulsed laser ablation plasmas generated in supercritical fluids, and possible applicationsThe use of DNA nanostructures in lithographyCMOS-compatible silicon nanowire biosensorsThe use of titanium oxide-B nanowires to detect explosive vaporsThe properties of protective layers on silver nanoparticles for ink-jet printingNanostructured thin-film production using microreactorsA one-stop reference for professionals, researchers, and graduate students working in nanofabrication, this book will also be useful for investors who want an overview of the current nanofabrication landscape.

Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal–oxide–semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe.The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include:Nanoscale advances in current MOSFET/CMOS technologyNano capacitors for applications such as electronics packaging and humidity sensorsSingle electron transistors and other electron tunneling devicesQuantum cellular automata and nanomagnetic logicMemristors as switching devices and for memoryGraphene preparation, properties, and devicesCarbon nanotubes (CNTs), both single CNT and random networkOther CNT applications such as terahertz, sensors, interconnects, and capacitorsNano system architectures for reliabilityNanowire device fabrication and applicationsNanowire transistorsNanodevices for spintronicsThe book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends.

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.