Katsuaki Suganuma – författare

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.

Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.- Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance- Provides the latest research on potential solutions, with an eye towards the end goal of system integration- Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Assessing the scientific and technological aspects of lead-free soldering, this reference considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties, plating and processing technologies, and evaluation methods vital to the production of lead-free solders in electronics. Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses soldering inspection and design, mechanical evaluation in electronics, lead-free solder paste and reflow soldering, plating lead-free soldering in electronics, and wave soldering.

This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.