Khaled Salah – författare

This book discusses the trust models for next-generation Blockchain ecosystems. The book provides a comprehensive discussion on various trust factors involving security, anonymization, reputation, governance, economic models, and other relevant determinants. The book covers various topics in breadth and depth. In addition, it sets the foundation to involve the readers in understanding the core theories supplemented with technical and experimental discussion. The book starts by laying out the foundations of trust models in Blockchain ecosystems. The authors then provide a study of existing trust models Blockchain networks. They then provide identification of trust factors and discuss each trust factor. The book concludes with a future outlook of trust-enabling Blockchain ecosystems.Outlines the trust models for next-generation Blockchain ecosystems;Covers the trust issues in various Blockchain ecosystems running in public, private, consortium, and cloud environments;Features issues such has privacy, security, scalability, and requirements in Blockchain.

This book discusses the trust models for next-generation Blockchain ecosystems. The book provides a comprehensive discussion on various trust factors involving security, anonymization, reputation, governance, economic models, and other relevant determinants. The book covers various topics in breadth and depth. In addition, it sets the foundation to involve the readers in understanding the core theories supplemented with technical and experimental discussion. The book starts by laying out the foundations of trust models in Blockchain ecosystems. The authors then provide a study of existing trust models Blockchain networks. They then provide identification of trust factors and discuss each trust factor. The book concludes with a future outlook of trust-enabling Blockchain ecosystems.

Outlines the trust models for next-generation Blockchain ecosystems;Covers the trust issues in various Blockchain ecosystems running in public, private, consortium, and cloud environments;Features issues such has privacy, security, scalability, and requirements in Blockchain.

This book discusses the trust models for next-generation Blockchain ecosystems. The book provides a comprehensive discussion on various trust factors involving security, anonymization, reputation, governance, economic models, and other relevant determinants. The book covers various topics in breadth and depth. In addition, it sets the foundation to involve the readers in understanding the core theories supplemented with technical and experimental discussion. The book starts by laying out the foundations of trust models in Blockchain ecosystems. The authors then provide a study of existing trust models Blockchain networks. They then provide identification of trust factors and discuss each trust factor. The book concludes with a future outlook of trust-enabling Blockchain ecosystems.Outlines the trust models for next-generation Blockchain ecosystems;Covers the trust issues in various Blockchain ecosystems running in public, private, consortium, and cloud environments;Features issues such has privacy, security, scalability, and requirements in Blockchain.

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.