L.L Vasiliev – författare

Developing clean energy and utilizing waste energy has become increasingly vital. Research targeting the advancement of thermally powered adsorption cooling technologies has progressed in the past few decades, and the awareness of fuel cells and thermally activated (heat pipe heat exchangers) adsorption systems using natural refrigerants and/or alternatives to hydrofluorocarbon-based refrigerants is becoming ever more important. Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications concentrates on state-of-the-art adsorption research and technologies for relevant applications based on the use of efficient heat transfer devices—heat pipe and two-phase thermosyphons—with the objectives of energy efficiency and sustainability. This book also discusses heat pipe thermal control as it relates to spacecraft applications.The first few chapters of Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications focus on heating and cooling, the principles of adsorption, adsorption dynamics, and the availability of three-phase boundaries. Other chapters cover successful heat pipe applications and heat-pipe-based thermal control of fuel cells, solid sorption transformers, and electronic components and air-condition devices. The final chapters summarize the achievements in the field of heat and mass transfer study in heat pipes with variable properties such as gas loaded heat pipes. Several configurations of thermosyphons are showcased, with suggested applications. A number of examples of equipment using the thermosyphon technology are presented and, in the final chapter, the concept of flow boiling and flow condensation heat transfer in micochannels is analyzed in detail.

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.