Mohd Arif Anuar Mohd Salleh – författare
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12 produkter
12 produkter
Häftad, Engelska, 2024
2 317 kr
Skickas inom 10-15 vardagar
Recent Developments of Geopolymer Materials: Processing and Characterisations focuses on the development, processing, and characterization of sustainable and eco-friendly materials, highlighting recent research developments in this field. The book covers the processing and characterization of geopolymers, incorporating green materials from waste and recycled materials specifically for construction applications, as well as advanced processing and characterization for a wide variety of applications. The book provides in-depth chapters on the development, processing, and characterization of sustainable and green materials with extensive uses, such as construction.It is divided into two sections: Development of Geopolymer Materials for Construction Applications and Advanced Processing and Characterization for Wider Applications, and will be a useful resource for academics, engineers, companies, and stakeholders in geopolymers from green materials for a variety of wide applications, including construction materials, ceramics, adsorbents, drilling properties, and simulation analysis.Provides new knowledge and the latest technology and research relating to the processing and characterization of geopolymers incorporating green materials from waste and recycled materialsCovers the latest research on variety of wide applications, including construction materials, ceramics, adsorbents, drilling properties, and simulation analysisIncludes in-depth coverage of the benefits of geopolymer technology
E-bok
Engelska, 20243 300 kr
Läs direkt efter köp
Recent Developments of Geopolymer Materials: Processing and Characterisations focuses on the development, processing, and characterization of sustainable and eco-friendly materials, highlighting recent research developments in this field. The book covers the processing and characterization of geopolymers, incorporating green materials from waste and recycled materials specifically for construction applications, as well as advanced processing and characterization for a wide variety of applications. The book provides in-depth chapters on the development, processing, and characterization of sustainable and green materials with extensive uses, such as construction.It is divided into two sections: Development of Geopolymer Materials for Construction Applications and Advanced Processing and Characterization for Wider Applications, and will be a useful resource for academics, engineers, companies, and stakeholders in geopolymers from green materials for a variety of wide applications, including construction materials, ceramics, adsorbents, drilling properties, and simulation analysis.- Provides new knowledge and the latest technology and research relating to the processing and characterization of geopolymers incorporating green materials from waste and recycled materials- Covers the latest research on variety of wide applications, including construction materials, ceramics, adsorbents, drilling properties, and simulation analysis- Includes in-depth coverage of the benefits of geopolymer technology
Inbunden, Engelska, 2022
1 940 kr
Skickas inom 10-15 vardagar
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
E-bok
Engelska, 20222 524 kr
Läs direkt efter köp
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Häftad, Engelska, 2023
1 940 kr
Skickas inom 10-15 vardagar
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Inbunden, Engelska, 2023
1 941 kr
Skickas inom 10-15 vardagar
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
E-bok
Engelska, 20231 733 kr
Läs direkt efter köp
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
648 kr
Skickas inom 5-8 vardagar
Häftad, Engelska, 2024
1 404 kr
Skickas inom 10-15 vardagar
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Del 418 - Springer Proceedings in Physics
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam
Inbunden, Engelska, 2025
1 726 kr
Skickas inom 10-15 vardagar
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
E-bok
Engelska, 20252 207 kr
Läs direkt efter köp
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
Del 418 - Springer Proceedings in Physics
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam
Häftad, Engelska, 2026
1 296 kr
Skickas inom 10-15 vardagar
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.