Mohd Arif Anuar Mohd Salleh – författare

Recent Developments of Geopolymer Materials: Processing and Characterisations focuses on the development, processing, and characterization of sustainable and eco-friendly materials, highlighting recent research developments in this field. The book covers the processing and characterization of geopolymers, incorporating green materials from waste and recycled materials specifically for construction applications, as well as advanced processing and characterization for a wide variety of applications. The book provides in-depth chapters on the development, processing, and characterization of sustainable and green materials with extensive uses, such as construction.It is divided into two sections: Development of Geopolymer Materials for Construction Applications and Advanced Processing and Characterization for Wider Applications, and will be a useful resource for academics, engineers, companies, and stakeholders in geopolymers from green materials for a variety of wide applications, including construction materials, ceramics, adsorbents, drilling properties, and simulation analysis.Provides new knowledge and the latest technology and research relating to the processing and characterization of geopolymers incorporating green materials from waste and recycled materialsCovers the latest research on variety of wide applications, including construction materials, ceramics, adsorbents, drilling properties, and simulation analysisIncludes in-depth coverage of the benefits of geopolymer technology

The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB).

The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB).

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th  and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.​

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th  and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.​