Nauman Khan – författare
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2 produkter
Designing TSVs for 3D Integrated Circuits
Häftad, 2012
551 kr
Lägg i varukorg
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside …
Designing TSVs for 3D Integrated Circuits
E-bok, 2012
718 kr
Lägg i varukorg
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside …