Roger I. Tanner - Böcker

This book sets out to provide a guide, with examples, for those who wish to make predictions about the mechanical and thermal behaviour of non-Newtonian materials in engineering and processing technology. After an introductory survey of the field and a review of basic continuum mechanics, the radical differences between elongational and shear behaviour are shown. Two chapters, one based on a continuum approach and the other using microstructural approaches, lead to useful mathematical desriptions of materials for engineering applications. As examples of nearly-viscometric and nearly-elongational flows, there is a discussion of lubrication and related shearing flows, and fibre- spinning and film-blowing respectively. A long chapter is devoted to the important new field of computational rheology, and this is followed by chapters on stability and turbulence and the all-important temperature effects in flow. This new edition contains much new material not available in book form elsewhere-for example wall slip, suspension rheology, computational rheology and new results in stability theory.

This book covers fundamental principles and numerical methods relevant to the modeling of the injection molding process. As injection molding processing is related to rheology, mechanical and chemical engineering, polymer science and computational methods, and is a rapidly growing field, the book provides a multidisciplinary and comprehensive introduction to the subjects required for an understanding of the complex process. It addresses the up-to-date status of fundamental understanding and simulation technologies, without losing sight of still useful classical approaches. The main chapters of the book are devoted to the currently active fields of flow-induced crystallization and orientation evolution of fiber suspensions, respectively, followed by detailed discussion of their effects on mechanical property, shrinkage and warpage of injection-molded products. The level of the proposed book will be suitable for interested scientists, R&D engineers, application engineers, and graduate students in engineering.