Sami Franssila – författare

This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered.

This second edition includes:

expanded sections on MEMS and microfluidics related fabrication issues new chapters on polymer and glass microprocessing, as well as serial processing techniques 200 completely new and 200 modified figures more coverage of imprinting techniques, process integration and economics of microfabrication 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book

With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike.

www.wiley.com/go/Franssila_Micro2e

This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes: expanded sections on MEMS and microfluidics related fabrication issuesnew chapters on polymer and glass microprocessing, as well as serial processing techniques200 completely new and 200 modified figuresmore coverage of imprinting techniques, process integration and economics of microfabrication300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problemssolutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the bookWith clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike.www.wiley.com/go/Franssila_Micro2e

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.Key topics covered include:- Silicon as MEMS material- Material properties and measurement techniques- Analytical methods used in materials characterization- Modeling in MEMS- Measuring MEMS- Micromachining technologies in MEMS- Encapsulation of MEMS components- Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.- Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.- Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.- Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.- Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.- Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques- Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs- Discusses properties, preparation, and growth of silicon crystals and wafers- Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures