William D. Brown – författare

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

"Complete dependence on semiconductor vendors' application notes and data sheets is now a thing of the past thanks to this all-in-one comparison text on nonvolatile semiconductor memory (NVSM) technology. Working electronics engineers can now refer to this book to access the technical data and applications-focused perspective they need to make intelligent decisions regarding the selection, specification, procurement, and application of NVSM devices. The most comprehensive book in the field, NONVOLATILE SEMICONDUCTOR MEMORY TECHNOLOGY gathers expertly-written information scattered throughout device literature in a single, well-balanced volume. This book features an in-depth overview accompanied by applications-oriented chapters on device reliability and endurance, radiation tolerance, as well as device physics and design. It is an essential reference for electronics engineers." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society, IEEE Solid-State Circuits Council/Society.