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A comprehensive guide to 3D MEMS packaging methods and solutions
Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.
This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored:
Advanced IC and MEMS packaging trendsMEMS devices, commercial applications, and marketsMore than 360 MEMS packaging patents and 10 3D MEMS packaging designsTSV for 3D MEMS packagingMEMS wafer thinning, dicing, and handlingLow-temperature C2C, C2W, and W2W bondingReliability of RoHS-compliant MEMS packagingMicromachining and water bonding techniquesActuation mechanisms and integrated micromachiningBubble switch, optical switch, and VOA MEMS packagingBolometer and accelerameter MEMS packagingBio-MEMS and biosensor MEMS packagingRF MEMS switches, tunable circuits, and packaging