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1. 

   Reliability Technology for Integrated Circuit Packaging

   Av Bin Zhou, Yunfei En m. fl.

   Inbunden, 2026

   1752 kr

   Lägg i varukorg

   This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and …