Electrodissolution Processes

Madhav Datta is an R&D professional with extensive experience in academic and industrial research. He received a BS in chemical engineering from H.B. Technological Institute, Kanpur, an MS in chemical engineering from the University of California at Los Angeles, and a PhD from the Materials Department of Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland in 1975. Dr. Datta’s affiliations include the Materials Department of EPFL (1973–1984), IBM’s T.J. Watson Research Center, Yorktown Heights, New York (1985–1999), Intel’s Logic Technology Development, Portland, Oregon (1999–2002); and Emerson Network Power’s Cooligy Precision Cooling, Mountain View, California (2003–2013). In 2015, he joined the Coimbatore campus of Amrita Vishwa Vidyapeetham (Amrita University) as the Chairman of Amrita Center for Industrial Research and Innovation and a Distinguished Professor in the Chemical Engineering and Materials Science Department. His research interests include electrochemical dissolution and deposition, and their application in microelectronic packaging, including flip-chip technology, microcooling devices, and electronic materials. For his contribution to electrochemical processing and especially to electrodissolution processes as applied to microfabrication in the electronics industry, he was awarded the Electrodeposition Research Award of the Electrochemical Society in 1998. Dr. Datta is an innovator with 49 issued US Patents. He has over 100 scientific publications to his credit and is the author or editor of several books on electrochemical processing and micro/nanoelectronics. He coedited a series on New Trends in Electrochemical Technology. He has held several administrative positions, including divisional chairs in the Electrochemical Society (ECS) and the International Society of Electrochemistry (ISE). Dr. Datta chaired the Technology Working Group and Technology Implementation Group of National Electronics Manufacturing Initiative (NEMI) and developed a first-of-its-kind technology road map of energy storage systems for the electronics industry.

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• 1. Open-Circuit Metal Dissolution Processes 2. Anodic Behavior of Metals 3. Transpassive Films and Their Breakdown under ECM Conditions 4. Mass Transport and Current Distribution 5. High-Rate Anodic Dissolution of Fe, Ni, Cr, and Their Alloys 6. High-Rate Anodic Dissolution of Ti, W, and Their Carbides 7. Anodic Dissolution of Metals in Electropolishing Electrolytes 8. Electrochemical Machining 9. Electrochemical Micromachining: Maskless Techniques 10. Through-Mask Electrochemical Micromachining 11. Electropolishing in Practice 12. Electrochemical Planarization of Copper Interconnects