University of California, Irvine, USA

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• Lithography: Photolithography. Next-Generation Lithographies and Lithography Research. Pattern Transfer With Subtractive Techniques: Dry Etching. Wet Chemical Etching and Wet Bulk Micromachining—Pools as Tools. Thermal Energy-Based Removing. Mechanical Energy-Based Removing. Pattern Transfer With Additive Techniques: Physical and Chemical Vapor Deposition—Thin Film Properties and Surface Micromachining. Chemical, Photochemical and Electrochemical Forming Techniques. Thermal Energy-Based Forming Techniques—Thermoforming. Micro-Molding Techniques—LIGA.

University of California, Irvine, USA

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• Lithography: Photolithography. Next-Generation Lithographies and Lithography Research. Pattern Transfer With Subtractive Techniques: Dry Etching. Wet Chemical Etching and Wet Bulk Micromachining—Pools as Tools. Thermal Energy-Based Removing. Mechanical Energy-Based Removing. Pattern Transfer With Additive Techniques: Physical and Chemical Vapor Deposition—Thin Film Properties and Surface Micromachining. Chemical, Photochemical and Electrochemical Forming Techniques. Thermal Energy-Based Forming Techniques—Thermoforming. Micro-Molding Techniques—LIGA.

University of California, Irvine, USA

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• Lithography: Photolithography. Next-Generation Lithographies and Lithography Research. Pattern Transfer With Subtractive Techniques: Dry Etching. Wet Chemical Etching and Wet Bulk Micromachining—Pools as Tools. Thermal Energy-Based Removing. Mechanical Energy-Based Removing. Pattern Transfer With Additive Techniques: Physical and Chemical Vapor Deposition—Thin Film Properties and Surface Micromachining. Chemical, Photochemical and Electrochemical Forming Techniques. Thermal Energy-Based Forming Techniques—Thermoforming. Micro-Molding Techniques—LIGA.