3D Integration for NoC-based SoC Architectures

Häftad, Engelska, 2012

Del i serien Integrated Circuits and Systems

1 225 kr

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Beskrivning

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Produktinformation

Utgivningsdatum:2012-12-27
Mått:155 x 235 x 16 mm
Vikt:441 g
Format:Häftad
Språk:Engelska
Serie:Integrated Circuits and Systems
Antal sidor:278
Upplaga:2011
Förlag:Springer-Verlag New York Inc.
ISBN:9781461427483

Utforska kategorier

Innehållsförteckning

Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICs Containing Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.