Packaging of High Power Semiconductor Lasers

AvXingsheng Liu,Wei Zhao

Inbunden, Engelska, 2014

Del i serien Micro- and Opto-Electronic Materials, Structures, and Systems

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Beskrivning

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Produktinformation

Utgivningsdatum:2014-07-15
Mått:155 x 235 x 22 mm
Vikt:732 g
Format:Inbunden
Språk:Engelska
Serie:Micro- and Opto-Electronic Materials, Structures, and Systems
Antal sidor:402
Upplaga:2015
Förlag:Springer-Verlag New York Inc.
ISBN:9781461492627

Utforska kategorier

Övrig teknik och tillämpad vetenskap inom Naturvetenskap och teknik

Mer om författaren

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Innehållsförteckning

Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.