This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book focuses on the basic theories and key technologies for robotic vision. The book features an in-depth demonstration of system parameter calibration, three-dimensional vision measurement, object pose estimation, tracking control strategies, and multi-sensor fusion methods, accompanied by robotic guidance solutions in various applications. The contributed work can help promote the development and application of robotic guidance for autonomous navigation, grasping and manipulation tasks. Researchers and engineers in the field of robotic perception, visual measurement and visual tracking can benefit from the book. The potential users include undergraduates and postgraduates majoring in intelligent manufacturing and artificial intelligence. The basis of English translation of this book, originally in Chinese, was facilitated by artificial intelligence. The content was later revised by the author for accuracy.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book focuses on the basic theories and key technologies for robotic vision. The book features an in-depth demonstration of system parameter calibration, three-dimensional vision measurement, object pose estimation, tracking control strategies, and multi-sensor fusion methods, accompanied by robotic guidance solutions in various applications. The contributed work can help promote the development and application of robotic guidance for autonomous navigation, grasping and manipulation tasks. Researchers and engineers in the field of robotic perception, visual measurement and visual tracking can benefit from the book. The potential users include undergraduates and postgraduates majoring in intelligent manufacturing and artificial intelligence. The basis of English translation of this book, originally in Chinese, was facilitated by artificial intelligence. The content was later revised by the author for accuracy.