Micro- and Opto-Electronic Materials, Structures, and Systems – serie

Complete with encyclopedic coverage of sapphire's growth and fabrication and numerous practical applications, this book also covers many unusual physical and chemical properties of sapphire, as well as the main trends in the evolution of growth methods.

By the second half of the twentieth century, a new branch of materials science had come into being — crystalline materials research. Its appearance is linked to the emergence of advanced technologies primarily based on single crystals (bulk crystals and films). At the turn of the last century, the impending onset of the “ceramic era” was forecasted. It was believed that ceramics would play a role comparable to that of the Stone or Bronze Ages in the history of civilization. Naturally, such an assumption was hypothetical, but it showed that ceramic materials had evoked keen interest among researchers. Although sapphire traditionally has been considered a gem, it has developed into a material typical of the “ceramic era.” Widening the field of sapphire application necessitated essential improvement of its homogeneity and working characteristics and extension of the range of sapphire products, especially those with stipulated properties including a preset structural defect distribution. In the early 1980s, successful attainment of crystals with predetermined char- teristics was attributed to proper choice of the growth method. At present, in view of the fact that the requirements for crystalline products have become more str- gent, such an approach tends to be insufficient. It is clear that one must take into account the physical–chemical processes that take place during the formation of the real crystal structure, i.e., the growth mechanisms and the nature and causes of crystal imperfections.

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

This book offers a complete overview of photonic-enhanced materials from material development to a final photonic biomedical application. It includes fundamental, applied, and industrial photonics. The authors cover synthesis, the modification and the processing of a variety of (bio)polymers including thermoplasts (e.g.